설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The AMAT CENTURA AP ULTIMA X is a high-density plasma chemical vapor deposition (CVD) system designed for semiconductor manufacturing in both 200mm and 300mm configurations. As an industry-leading workhorse, it excels in delivering high-quality dielectric films and void-free gap fill, crucial for advanced chip fabrication. The system's dual RF coils provide superior gap-fill capability across the wafer, while its innovative electrostatic chuck ensures excellent film quality and uniformity. Combined with remote plasma clean technology, it achieves exceptional defect control and improved mean-wafer-between-clean performance. The Ultima HDP system's advanced technology enables deposition of both undoped and doped films, catering to various applications such as shallow trench isolation (STI), pre-metal dielectric (PMD), interlayer dielectric (ILD), inter-metal dielectric (IMD), and passivation. Its versatility also extends to etchback and high-density plasma treatments, enhancing film quality in semiconductor manufacturing processes.문서
문서 없음
카테고리
CVD
마지막 검증일: 11일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
142051
웨이퍼 사이즈:
12"/300mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
Centura AP Ultima X
카테고리
CVD
마지막 검증일: 11일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
142051
웨이퍼 사이즈:
12"/300mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The AMAT CENTURA AP ULTIMA X is a high-density plasma chemical vapor deposition (CVD) system designed for semiconductor manufacturing in both 200mm and 300mm configurations. As an industry-leading workhorse, it excels in delivering high-quality dielectric films and void-free gap fill, crucial for advanced chip fabrication. The system's dual RF coils provide superior gap-fill capability across the wafer, while its innovative electrostatic chuck ensures excellent film quality and uniformity. Combined with remote plasma clean technology, it achieves exceptional defect control and improved mean-wafer-between-clean performance. The Ultima HDP system's advanced technology enables deposition of both undoped and doped films, catering to various applications such as shallow trench isolation (STI), pre-metal dielectric (PMD), interlayer dielectric (ILD), inter-metal dielectric (IMD), and passivation. Its versatility also extends to etchback and high-density plasma treatments, enhancing film quality in semiconductor manufacturing processes.문서
문서 없음