설명
Wafer Size Range Minimum 200 mm Maximum 200 mm CE Marked YES Exterior Dimensions Width 79.921 in (203.0 cm) Depth 98.425 in (250.0 cm) Height 94.488 in (240.0 cm) Weight 4,010 lb (1,819 kg)환경 설정
Development_CVD_TiTINOEM 모델 설명
The Centura TxZ is a chemical vapor deposition (CVD) system that is used for depositing thin films of various materials on semiconductor wafers. It can be used with 8” wafer size and CVD system size is also 8”. In September 1996, the Liner TxZ Centura system was launched. This system combines a new CVD TiN chamber with a Coherent PVD Ti chamber, and allows for deposition of sequential layers of Ti and CVD TiN in high-aspect-ratio metal structures under vacuum. In September 1996, the Liner TxZ Centura system was launched. This system combines a new CVD TiN chamber with a Coherent PVD Ti chamber, and allows for deposition of sequential layers of Ti and CVD TiN in high-aspect-ratio metal structures under vacuum.문서
문서 없음
카테고리
CVD
마지막 검증일: 4일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
147432
웨이퍼 사이즈:
8"/200mm
빈티지:
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
CENTURA TxZ
카테고리
CVD
마지막 검증일: 4일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
147432
웨이퍼 사이즈:
8"/200mm
빈티지:
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Wafer Size Range Minimum 200 mm Maximum 200 mm CE Marked YES Exterior Dimensions Width 79.921 in (203.0 cm) Depth 98.425 in (250.0 cm) Height 94.488 in (240.0 cm) Weight 4,010 lb (1,819 kg)환경 설정
Development_CVD_TiTINOEM 모델 설명
The Centura TxZ is a chemical vapor deposition (CVD) system that is used for depositing thin films of various materials on semiconductor wafers. It can be used with 8” wafer size and CVD system size is also 8”. In September 1996, the Liner TxZ Centura system was launched. This system combines a new CVD TiN chamber with a Coherent PVD Ti chamber, and allows for deposition of sequential layers of Ti and CVD TiN in high-aspect-ratio metal structures under vacuum. In September 1996, the Liner TxZ Centura system was launched. This system combines a new CVD TiN chamber with a Coherent PVD Ti chamber, and allows for deposition of sequential layers of Ti and CVD TiN in high-aspect-ratio metal structures under vacuum.문서
문서 없음