
설명
HDP CVD (Chemical Vapor Deposition)환경 설정
환경 설정 없음OEM 모델 설명
Centura Ultima HDP 200mm and 300mm systems deliver a high-density plasma CVD process. It has been the industry-leading workhorse delivering high-quality dielectric films and void-free gapfill. Its reactor enables customers to achieve the productivity, cost-efficiency, and extendibility needed for multi-generation manufacturing. The Ultima HDP system features dual RF coils for superior gap-fill capability across the wafer; its innovative electrostatic chuck enables excellent film quality and uniformity; combined with remote plasma clean, it delivers exceptional defect and mean-wafer-between-clean performance. The product’s advanced technology enables deposition of both undoped and doped films for a wide range of applications, including STI, PMD, ILD, IMD, and passivation. Its versatility further extends to etchback and high-density plasma treatment for improved film quality.문서
문서 없음
카테고리
CVD
마지막 검증일: 8일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
147499
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
CENTURA ULTIMA TE
카테고리
CVD
마지막 검증일: 8일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
147499
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
HDP CVD (Chemical Vapor Deposition)환경 설정
환경 설정 없음OEM 모델 설명
Centura Ultima HDP 200mm and 300mm systems deliver a high-density plasma CVD process. It has been the industry-leading workhorse delivering high-quality dielectric films and void-free gapfill. Its reactor enables customers to achieve the productivity, cost-efficiency, and extendibility needed for multi-generation manufacturing. The Ultima HDP system features dual RF coils for superior gap-fill capability across the wafer; its innovative electrostatic chuck enables excellent film quality and uniformity; combined with remote plasma clean, it delivers exceptional defect and mean-wafer-between-clean performance. The product’s advanced technology enables deposition of both undoped and doped films for a wide range of applications, including STI, PMD, ILD, IMD, and passivation. Its versatility further extends to etchback and high-density plasma treatment for improved film quality.문서
문서 없음