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LAM RESEARCH / NOVELLUS CONCEPT TWO "C2" DUAL SEQUEL
  • LAM RESEARCH / NOVELLUS CONCEPT TWO "C2" DUAL SEQUEL
  • LAM RESEARCH / NOVELLUS CONCEPT TWO "C2" DUAL SEQUEL
  • LAM RESEARCH / NOVELLUS CONCEPT TWO "C2" DUAL SEQUEL
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The NOVELLUS CONCEPT TWO DUAL SEQUEL is a system that uses reactive ion-beam deposition to deposit thick films onto wafers. It has two process chambers that can provide the throughput power of twelve stations, resulting in dramatic improvements in productivity for these types of films. It is designed for high throughput deposition of thick films, such as layers before CMP (chemical-mechanical planarization), and dual layer passivation films. It also offers dual-beam operation for increased wafer-to-wafer uniformity and higher deposition rates, as well as process control capabilities and versatile materials handling for a wide range of applications.
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PREFERRED
 
SELLER
카테고리
CVD

마지막 검증일: 60일 이상 전

Buyer pays 12% premium of final sale price
주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

114141


웨이퍼 사이즈:

알 수 없음


빈티지:

알 수 없음


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
 
SELLER

LAM RESEARCH / NOVELLUS

CONCEPT TWO "C2" DUAL SEQUEL

verified-listing-icon
검증됨
카테고리
CVD
마지막 검증일: 60일 이상 전
listing-photo-b47c3b459fc849b6b06cede7122e7793-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
Buyer pays 12% premium of final sale price
주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

114141


웨이퍼 사이즈:

알 수 없음


빈티지:

알 수 없음


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음
환경 설정
환경 설정 없음
OEM 모델 설명
The NOVELLUS CONCEPT TWO DUAL SEQUEL is a system that uses reactive ion-beam deposition to deposit thick films onto wafers. It has two process chambers that can provide the throughput power of twelve stations, resulting in dramatic improvements in productivity for these types of films. It is designed for high throughput deposition of thick films, such as layers before CMP (chemical-mechanical planarization), and dual layer passivation films. It also offers dual-beam operation for increased wafer-to-wafer uniformity and higher deposition rates, as well as process control capabilities and versatile materials handling for a wide range of applications.
문서

문서 없음