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LAM RESEARCH / NOVELLUS INOVA
    설명
    Cu Barrier Seed depostion
    환경 설정
    Software Version: 5.65 CIM: SECS/GEM Process: TFM_Cu Barrier Seed_Novellus Main System LAM INOVA NExT 1 OK Handler System Standard Automation and Software 1 OK Factory Interface FOUP 3 OK Options System CH1 - HCM Cu ALP 1 OK Options System CH5 - HCM Ta IONX 1 OK Options System CH7 - HCM Cu ALP 1 OK Options System LDG - Degas 1 OK Options System CH4 - Cool Station 1 OK Options System RDG - Degas 1 OK Options System CH3 - HCM Ta IONX 1 OK
    OEM 모델 설명
    The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.
    문서

    문서 없음

    LAM RESEARCH / NOVELLUS

    INOVA

    verified-listing-icon

    검증됨

    카테고리
    CVD

    마지막 검증일: 60일 이상 전

    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    105969


    웨이퍼 사이즈:

    12"/300mm


    빈티지:

    2014


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    유사 등재물
    모두 보기
    LAM RESEARCH / NOVELLUS INOVA

    LAM RESEARCH / NOVELLUS

    INOVA

    CVD
    빈티지: 2012조건: 중고
    마지막 검증일60일 이상 전

    LAM RESEARCH / NOVELLUS

    INOVA

    verified-listing-icon
    검증됨
    카테고리
    CVD
    마지막 검증일: 60일 이상 전
    listing-photo-2a1136ff29854897956ccf63431c1a1e-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/52814/2a1136ff29854897956ccf63431c1a1e/b02bc649fecb438fb6e350cab9b86779_9fb669203cb048b4a17ed3df17345a381201a_mw.jpeg
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    105969


    웨이퍼 사이즈:

    12"/300mm


    빈티지:

    2014


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    Cu Barrier Seed depostion
    환경 설정
    Software Version: 5.65 CIM: SECS/GEM Process: TFM_Cu Barrier Seed_Novellus Main System LAM INOVA NExT 1 OK Handler System Standard Automation and Software 1 OK Factory Interface FOUP 3 OK Options System CH1 - HCM Cu ALP 1 OK Options System CH5 - HCM Ta IONX 1 OK Options System CH7 - HCM Cu ALP 1 OK Options System LDG - Degas 1 OK Options System CH4 - Cool Station 1 OK Options System RDG - Degas 1 OK Options System CH3 - HCM Ta IONX 1 OK
    OEM 모델 설명
    The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.
    문서

    문서 없음

    유사 등재물
    모두 보기
    LAM RESEARCH / NOVELLUS INOVA

    LAM RESEARCH / NOVELLUS

    INOVA

    CVD빈티지: 2012조건: 중고마지막 검증일:60일 이상 전
    LAM RESEARCH / NOVELLUS INOVA

    LAM RESEARCH / NOVELLUS

    INOVA

    CVD빈티지: 1999조건: 중고마지막 검증일:60일 이상 전
    LAM RESEARCH / NOVELLUS INOVA

    LAM RESEARCH / NOVELLUS

    INOVA

    CVD빈티지: 2012조건: 중고마지막 검증일:60일 이상 전