설명
TFM_Cu Barrier Seed_Novellus , CH1 - HCM Cu ALP (2%Mn), CH3 - HCM Ta IONX, CH4 - Cool station, CH5 - HCM Ta IONX, CH7 - HCM Cu AS (2%Mn))환경 설정
환경 설정 없음OEM 모델 설명
The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.문서
문서 없음
카테고리
CVD
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
128077
웨이퍼 사이즈:
12"/300mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
LAM RESEARCH / NOVELLUS
INOVA
카테고리
CVD
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
128077
웨이퍼 사이즈:
12"/300mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
TFM_Cu Barrier Seed_Novellus , CH1 - HCM Cu ALP (2%Mn), CH3 - HCM Ta IONX, CH4 - Cool station, CH5 - HCM Ta IONX, CH7 - HCM Cu AS (2%Mn))환경 설정
환경 설정 없음OEM 모델 설명
The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.문서
문서 없음