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설명
설명 없음환경 설정
Dual Process Chamber -ICP source 2 MHz up to 2000 W with temperature control -Substrate temperature control via bipolar Johnsen-Rahbek electrostatic chuck with backside Helium cooling -CCP source 13.56 MHz up to 600 W -Thermally managed chamber liner and pump train -Optical emission spectroscopy Gases and maximum flows in positions 1 to 8 are CF4 (84 sccm), O2 (1000 sccm), He (50sccm), Ar (50 sccm), O2 (50 sccm), CHF3 (100 sccm), N2 (200 sccm) and H2 (100 sccm) respectively. The operating system is Windows 7 Professional, tool software is Plasma-Therm Cortex and the OES software is Plasma-Therm EndpointWorks Wafer size configuration is 6’’ JEIDA flatOEM 모델 설명
VERSALINE system models are configured to perform an array of etch and deposition processes. Ion beam technology suits a range of applications, from low, controllable damage etching to high-rate, high-aspect-ratio, deep silicon etching to difficult materials. The systems support process control through EndpointWorks®. Enhancements include data logging, automated maintenance scheduler (AMS), and SECS/GEM. Our Cortex® control system provides a stable, user-friendly control interface designed for efficiency and productivity. The VERSALINE platform’s modular design allows for flexible configuration of substrate handling for a variety of handling options, from R&D single wafer or carrier loading with a loadlock to high-volume, multi-chamber production clusters. Clear upgrade paths that leverage costs and process development make future planning easy.문서
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카테고리
CVD
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
66907
웨이퍼 사이즈:
6"/150mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
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PLASMATHERM
VERSALINE CVD
카테고리
CVD
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
66907
웨이퍼 사이즈:
6"/150mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
Dual Process Chamber -ICP source 2 MHz up to 2000 W with temperature control -Substrate temperature control via bipolar Johnsen-Rahbek electrostatic chuck with backside Helium cooling -CCP source 13.56 MHz up to 600 W -Thermally managed chamber liner and pump train -Optical emission spectroscopy Gases and maximum flows in positions 1 to 8 are CF4 (84 sccm), O2 (1000 sccm), He (50sccm), Ar (50 sccm), O2 (50 sccm), CHF3 (100 sccm), N2 (200 sccm) and H2 (100 sccm) respectively. The operating system is Windows 7 Professional, tool software is Plasma-Therm Cortex and the OES software is Plasma-Therm EndpointWorks Wafer size configuration is 6’’ JEIDA flatOEM 모델 설명
VERSALINE system models are configured to perform an array of etch and deposition processes. Ion beam technology suits a range of applications, from low, controllable damage etching to high-rate, high-aspect-ratio, deep silicon etching to difficult materials. The systems support process control through EndpointWorks®. Enhancements include data logging, automated maintenance scheduler (AMS), and SECS/GEM. Our Cortex® control system provides a stable, user-friendly control interface designed for efficiency and productivity. The VERSALINE platform’s modular design allows for flexible configuration of substrate handling for a variety of handling options, from R&D single wafer or carrier loading with a loadlock to high-volume, multi-chamber production clusters. Clear upgrade paths that leverage costs and process development make future planning easy.문서
문서 없음