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TEL / TOKYO ELECTRON TRIASe+ W
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    OEM 모델 설명
    Triase+™ W is a 300mm single-wafer CVD system that delivers high step coverage tungsten (W) film deposition using WF6. By combining rapid heat up and cool down of wafer temperatures and with plasma-less chamber cleaning technology, the system achieves higher productivity and lower CoO. Utilizing SFD and CVD methods respectively, the Triase+™ W provides in-situ deposition of both nucleation and bulk film. This ensures high step coverage, even with small geometry, contact holes. The system is also capable of depositing low-resistance film to meet further scaling needs, and is suitable for such applications as contact plug formation and via filling.
    문서

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    TEL / TOKYO ELECTRON

    TRIASe+ W

    verified-listing-icon

    검증됨

    카테고리
    CVD

    마지막 검증일: 7일 전

    주요 품목 세부 정보

    조건:

    New


    작동 상태:

    알 수 없음


    제품 ID:

    116431


    웨이퍼 사이즈:

    12"/300mm


    빈티지:

    2022


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    유사 등재물
    모두 보기
    TEL / TOKYO ELECTRON TRIASe+ W

    TEL / TOKYO ELECTRON

    TRIASe+ W

    CVD
    빈티지: 2022조건: 신규
    마지막 검증일7일 전

    TEL / TOKYO ELECTRON

    TRIASe+ W

    verified-listing-icon
    검증됨
    카테고리
    CVD
    마지막 검증일: 7일 전
    listing-photo-1ca4b1d95de44bd98b06075cd6c4cc1b-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    주요 품목 세부 정보

    조건:

    New


    작동 상태:

    알 수 없음


    제품 ID:

    116431


    웨이퍼 사이즈:

    12"/300mm


    빈티지:

    2022


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    설명 없음
    환경 설정
    환경 설정 없음
    OEM 모델 설명
    Triase+™ W is a 300mm single-wafer CVD system that delivers high step coverage tungsten (W) film deposition using WF6. By combining rapid heat up and cool down of wafer temperatures and with plasma-less chamber cleaning technology, the system achieves higher productivity and lower CoO. Utilizing SFD and CVD methods respectively, the Triase+™ W provides in-situ deposition of both nucleation and bulk film. This ensures high step coverage, even with small geometry, contact holes. The system is also capable of depositing low-resistance film to meet further scaling needs, and is suitable for such applications as contact plug formation and via filling.
    문서

    문서 없음

    유사 등재물
    모두 보기
    TEL / TOKYO ELECTRON TRIASe+ W

    TEL / TOKYO ELECTRON

    TRIASe+ W

    CVD빈티지: 2022조건: 신규마지막 검증일:7일 전