설명
System has always been under full service contract and is in very good conditioning. Uvision SP 200 is a BF (Bright Field) wafer inspection tool It is designed to inspect pattern wafers, but it can also inspect bare and unpatterned wafers Ligth source: Laser ( ג= 266 nm) Tool scans a wafer in a meander path Die to Die ” and Cell to Cell ” comparison capability Can use reflected --( BrigthField ) and scattered signal (GF = GreyField ) in parallel for detection On pattern wafers capable of detecting defects of 25 nm with 90 % Capture Rate (Data from D&E recipe환경 설정
Uvision SP 200 is a BF (Bright Field) wafer inspection tool 200/300 mm capebiliity It is designed to inspect pattern wafers, but it can also inspect bare and unpatterned wafers Ligth source: Laser ( ג= 266 nm) Tool scans a wafer in a meander path Die to Die ” and Cell to Cell ” comparison capability Can use reflected --( BrigthField ) and scattered signal (GF = GreyField ) in parallel for detection On pattern wafers capable of detecting defects of 25 nm with 90 % Capture Rate (Data from D&E recipe,OEM 모델 설명
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APPLIED MATERIALS (AMAT)
UVISION 200
검증됨
카테고리
Defect Inspection
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Running
제품 ID:
113572
웨이퍼 사이즈:
12"/300mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
APPLIED MATERIALS (AMAT)
UVISION 200
카테고리
Defect Inspection
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Running
제품 ID:
113572
웨이퍼 사이즈:
12"/300mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
System has always been under full service contract and is in very good conditioning. Uvision SP 200 is a BF (Bright Field) wafer inspection tool It is designed to inspect pattern wafers, but it can also inspect bare and unpatterned wafers Ligth source: Laser ( ג= 266 nm) Tool scans a wafer in a meander path Die to Die ” and Cell to Cell ” comparison capability Can use reflected --( BrigthField ) and scattered signal (GF = GreyField ) in parallel for detection On pattern wafers capable of detecting defects of 25 nm with 90 % Capture Rate (Data from D&E recipe환경 설정
Uvision SP 200 is a BF (Bright Field) wafer inspection tool 200/300 mm capebiliity It is designed to inspect pattern wafers, but it can also inspect bare and unpatterned wafers Ligth source: Laser ( ג= 266 nm) Tool scans a wafer in a meander path Die to Die ” and Cell to Cell ” comparison capability Can use reflected --( BrigthField ) and scattered signal (GF = GreyField ) in parallel for detection On pattern wafers capable of detecting defects of 25 nm with 90 % Capture Rate (Data from D&E recipe,OEM 모델 설명
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