설명
System has always been under full service contract and is in very good conditioning. Uvision SP 200 is a BF (Bright Field) wafer inspection tool It is designed to inspect pattern wafers, but it can also inspect bare and unpatterned wafers Ligth source: Laser ( ג= 266 nm) Tool scans a wafer in a meander path Die to Die ” and Cell to Cell ” comparison capability Can use reflected --( BrigthField ) and scattered signal (GF = GreyField ) in parallel for detection On pattern wafers capable of detecting defects of 25 nm with 90 % Capture Rate (Data from D&E recipe환경 설정
Uvision SP 200 is a BF (Bright Field) wafer inspection tool 200/300 mm capebiliity It is designed to inspect pattern wafers, but it can also inspect bare and unpatterned wafers Ligth source: Laser ( ג= 266 nm) Tool scans a wafer in a meander path Die to Die ” and Cell to Cell ” comparison capability Can use reflected --( BrigthField ) and scattered signal (GF = GreyField ) in parallel for detection On pattern wafers capable of detecting defects of 25 nm with 90 % Capture Rate (Data from D&E recipe,OEM 모델 설명
미제공문서
문서 없음
카테고리
Defect Inspection
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Running
제품 ID:
113572
웨이퍼 사이즈:
12"/300mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
UVISION 200
카테고리
Defect Inspection
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Running
제품 ID:
113572
웨이퍼 사이즈:
12"/300mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
System has always been under full service contract and is in very good conditioning. Uvision SP 200 is a BF (Bright Field) wafer inspection tool It is designed to inspect pattern wafers, but it can also inspect bare and unpatterned wafers Ligth source: Laser ( ג= 266 nm) Tool scans a wafer in a meander path Die to Die ” and Cell to Cell ” comparison capability Can use reflected --( BrigthField ) and scattered signal (GF = GreyField ) in parallel for detection On pattern wafers capable of detecting defects of 25 nm with 90 % Capture Rate (Data from D&E recipe환경 설정
Uvision SP 200 is a BF (Bright Field) wafer inspection tool 200/300 mm capebiliity It is designed to inspect pattern wafers, but it can also inspect bare and unpatterned wafers Ligth source: Laser ( ג= 266 nm) Tool scans a wafer in a meander path Die to Die ” and Cell to Cell ” comparison capability Can use reflected --( BrigthField ) and scattered signal (GF = GreyField ) in parallel for detection On pattern wafers capable of detecting defects of 25 nm with 90 % Capture Rate (Data from D&E recipe,OEM 모델 설명
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문서 없음