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APPLIED MATERIALS (AMAT) UVISION 5
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    The Applied UVision 5 wafer inspection system detects yield-limiting defects in the critical patterning layers of 22nm and below logic and memory devices. Applied also offers the Applied DFinder system, the first darkfield wafer inspection system to use DUV laser scanning to detect particles as small as 40nm in interconnect layers. The UVision® 5 system isa member of the UVision wafer inspection product family, supporting the same proprietary core technology of deep ultraviolet (DUV) laser illumination, with simultaneous dual channel [brightfield (BF) reflected light and grayfield (GF) scattered light] collection optics. The system exhibits new defect inspection capabilities on advanced patterning layers in both FEOL and BEOL applications for 2xnm production and beyond, addressing such technologies as ArF immersion lithography, double and quad patterning, and extreme ultraviolet layers. The UVision 5 system’s dramatically increased light density enables detection of 1xnm killer defects - some never captured before - resulting in a twofold improvement in killer defect capture rates. This, in turn, results in a more accurate and comprehensive defect Pareto that significantly improves statistical process control in the wafer fab. The platform’s unique GF detection architecture now captures more light to enable detection of defects in the range of 1xnm (approximately the width of up to five DNA strands). New imaging modes improve detection sensitivity to further increase UVision technology leadership in GF scanning. Novel image processing algorithms reduce wafer noise by up to 50% in various types of memory structures, contributing to a higher capture rate, especially on BEOL layers.
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    APPLIED MATERIALS (AMAT)

    UVISION 5

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    Defect Inspection

    마지막 검증일: 60일 이상 전

    주요 품목 세부 정보

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    제품 ID:

    105881


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    APPLIED MATERIALS (AMAT) UVISION 5

    APPLIED MATERIALS (AMAT)

    UVISION 5

    Defect Inspection
    빈티지: 0조건: 중고
    마지막 검증일14일 전

    APPLIED MATERIALS (AMAT)

    UVISION 5

    verified-listing-icon
    검증됨
    카테고리
    Defect Inspection
    마지막 검증일: 60일 이상 전
    listing-photo-239cb2608ac74ba6b987633396d54a92-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    105881


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    알 수 없음


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    설명 없음
    환경 설정
    환경 설정 없음
    OEM 모델 설명
    The Applied UVision 5 wafer inspection system detects yield-limiting defects in the critical patterning layers of 22nm and below logic and memory devices. Applied also offers the Applied DFinder system, the first darkfield wafer inspection system to use DUV laser scanning to detect particles as small as 40nm in interconnect layers. The UVision® 5 system isa member of the UVision wafer inspection product family, supporting the same proprietary core technology of deep ultraviolet (DUV) laser illumination, with simultaneous dual channel [brightfield (BF) reflected light and grayfield (GF) scattered light] collection optics. The system exhibits new defect inspection capabilities on advanced patterning layers in both FEOL and BEOL applications for 2xnm production and beyond, addressing such technologies as ArF immersion lithography, double and quad patterning, and extreme ultraviolet layers. The UVision 5 system’s dramatically increased light density enables detection of 1xnm killer defects - some never captured before - resulting in a twofold improvement in killer defect capture rates. This, in turn, results in a more accurate and comprehensive defect Pareto that significantly improves statistical process control in the wafer fab. The platform’s unique GF detection architecture now captures more light to enable detection of defects in the range of 1xnm (approximately the width of up to five DNA strands). New imaging modes improve detection sensitivity to further increase UVision technology leadership in GF scanning. Novel image processing algorithms reduce wafer noise by up to 50% in various types of memory structures, contributing to a higher capture rate, especially on BEOL layers.
    문서

    문서 없음

    유사 등재물
    모두 보기
    APPLIED MATERIALS (AMAT) UVISION 5

    APPLIED MATERIALS (AMAT)

    UVISION 5

    Defect Inspection빈티지: 0조건: 중고마지막 검증일:14일 전
    APPLIED MATERIALS (AMAT) UVISION 5

    APPLIED MATERIALS (AMAT)

    UVISION 5

    Defect Inspection빈티지: 2011조건: 중고마지막 검증일:60일 이상 전
    APPLIED MATERIALS (AMAT) UVISION 5

    APPLIED MATERIALS (AMAT)

    UVISION 5

    Defect Inspection빈티지: 2011조건: 중고마지막 검증일:60일 이상 전