설명
IQC환경 설정
환경 설정 없음OEM 모델 설명
Wafer inspection. Core technology of DUV laser illumination and full polarization control, with simultaneous dual channel (brightfield reflected light and grayfield scattered light) collection optics unique to this product line sub-10nm defect sensitivity. It also enhances defect inspection on advanced patterning layers in FEOL and BEOL applications for the 1xnm node, addressing technologies that include logic, DRAM, 3D NAND, double and quadruple patterning, and EUV layers. n addition, the UVision 8 system incorporates Marker 2, the next generation of an integrated CAD-based application that combines customer regions-of-interest information and wafer characteristics based on customer needs. This capability enhances sensitivity while also boosting capture rates of prioritized defects of interest, enabling region-of-interest based binning, and tightening coordinate accuracy문서
문서 없음
카테고리
Defect Inspection
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
120320
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
UVISION 8
카테고리
Defect Inspection
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
120320
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
IQC환경 설정
환경 설정 없음OEM 모델 설명
Wafer inspection. Core technology of DUV laser illumination and full polarization control, with simultaneous dual channel (brightfield reflected light and grayfield scattered light) collection optics unique to this product line sub-10nm defect sensitivity. It also enhances defect inspection on advanced patterning layers in FEOL and BEOL applications for the 1xnm node, addressing technologies that include logic, DRAM, 3D NAND, double and quadruple patterning, and EUV layers. n addition, the UVision 8 system incorporates Marker 2, the next generation of an integrated CAD-based application that combines customer regions-of-interest information and wafer characteristics based on customer needs. This capability enhances sensitivity while also boosting capture rates of prioritized defects of interest, enabling region-of-interest based binning, and tightening coordinate accuracy문서
문서 없음