설명
KLA-Tencor Candela 8600 Optical Surface Analyzer (OSA) is a laser-based inspection system for semiconductor and optoelectronic wafers. It is manual wafer handling tool. The Candela defect detection system simultaneously measures surface reflectivity and topography for automatic defect detection and classification. The defect detection system's inspection technology combines scatterometry, ellipsometry, reflectometry, and topographical analysis to non-destructively inspect wafer surfaces for defects, and film thickness uniformity, of opaque substrates, epi layers, and transparent film coatings (SiC, GaN, sapphire). *. Fully refurbished. Installed in Clean-room. Can demonstrate anytime.환경 설정
KLA-Tencor Candela 8600 Working - Laser: Oblique(50mW, 405nm), Normal(85mW, 660nm) - Spot size: 5㎛ x 4㎛. - Particle detection: smaller than 0.08㎛ on silicon substrate. - Scratch: 0.1㎛ wide, 1~2nm deep. - Pits and Bumps: 20㎛ diameter, 50Å;; deep. - Stains: 20㎛ diameter, 10Å;; thick. - can be used for both epi and bare substrate. - can be used for Si, GaAs, Al2O3,SiC substrate. - Substrage thickness: 350㎛ ~ 1,300㎛. - Air Balance system ULPA and HEPA air filter(replaced new one). - Input Power 230V 5A 50/60Hz - Input Air: CDA 90 PSIOEM 모델 설명
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KLA
CANDELA 8600
검증됨
카테고리
Defect Inspection
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
65982
웨이퍼 사이즈:
6"/150mm
빈티지:
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA
CANDELA 8600
검증됨
카테고리
Defect Inspection
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
65982
웨이퍼 사이즈:
6"/150mm
빈티지:
2011
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
KLA-Tencor Candela 8600 Optical Surface Analyzer (OSA) is a laser-based inspection system for semiconductor and optoelectronic wafers. It is manual wafer handling tool. The Candela defect detection system simultaneously measures surface reflectivity and topography for automatic defect detection and classification. The defect detection system's inspection technology combines scatterometry, ellipsometry, reflectometry, and topographical analysis to non-destructively inspect wafer surfaces for defects, and film thickness uniformity, of opaque substrates, epi layers, and transparent film coatings (SiC, GaN, sapphire). *. Fully refurbished. Installed in Clean-room. Can demonstrate anytime.환경 설정
KLA-Tencor Candela 8600 Working - Laser: Oblique(50mW, 405nm), Normal(85mW, 660nm) - Spot size: 5㎛ x 4㎛. - Particle detection: smaller than 0.08㎛ on silicon substrate. - Scratch: 0.1㎛ wide, 1~2nm deep. - Pits and Bumps: 20㎛ diameter, 50Å;; deep. - Stains: 20㎛ diameter, 10Å;; thick. - can be used for both epi and bare substrate. - can be used for Si, GaAs, Al2O3,SiC substrate. - Substrage thickness: 350㎛ ~ 1,300㎛. - Air Balance system ULPA and HEPA air filter(replaced new one). - Input Power 230V 5A 50/60Hz - Input Air: CDA 90 PSIOEM 모델 설명
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