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KLA SURFSCAN SP2
    설명
    Particle Measurement
    환경 설정
    Process: BAREINSP Tool config is based on original PO, please verify tool details at tool inspection STANDARD SPECIFICATIONS     Windows System    Windows XP SP3 Main S/W       NGS 5.4 SR3 HF3 Wafer Size    300mm SEMI Notch Carrier  3 AdvanTag SW CID, Phx, Shinko (load port)  8 user-configurable LEDs to display the loadport status  Load/unload button for manual delivery hand-off  Cassette / wafer mapping which allows the tool to generate a wafer map of the 300mm FOUP and detect wafer presence, empty slots and cross-slotted wafer. The wafer map can be displayed on the user screen and sent to a SECS host. Facilities  Power: 208 VAC, 3W-N  CDA: > 28.3 Nl/min, > 6.6791 kg/cm2  Vac: > 28.317 l/min, > -700 mm Hg Chamber  Powder Coat Panels Kit  200/300mm Vacuum option  Optical Filter Load port    Vacuum 300mm Dual FIMS Application  2mm Edge Exclusion  Oblique Incidence Illumination (High / Standard / Low)  Normal Incidence Illumination (High / Standard / Low)  Enhanced XY Coordinates  IDM  SP2  Standard Classification package  LPD-N Classification  LPD-ES classification  Grading and Sorting  Spatial Filter (20 degree)  Spatial Filter (40 degree)  Spatial filter (rough films)  Spatial filter (Back)  High Sensitivity Inspect Mode  High Throughput Inspect Mode Options  Haze  Haze Normalization  Haze Analysis  IC/OEM Mfg Surf Quality Recipe Wafer size.    300mm XY Calibration Wafer with first Article HARDWARE CONFIGURATION     Others    5 Color Light Tower (RBYGW) Ethernet  NFS Client  E84 enabled for OHT & AGV/RGV  E87 (Based on E39)  GEM/SECS and HSMS  E40/ E94/ E90 / E116 Handler    Secondary UI, Phoenix, SP2 Main Computer  Intel®Xeon™ CPU 3.20GHz  3.5 GB RAM Memory  DVD- ROM  Mouse  Keyboard  3.5" Floppy  NGS application software FEC computer  Intel®Pentium®4 CPU  512 MB RAM Memory                                                                                                    Damage/Missing parts list Please inspect tool to reconfirm
    OEM 모델 설명
    The Surfscan SP2 is an unpatterned wafer surface inspection tool that uses UV laser technology, darkfield optics, and advanced algorithms to detect defects as small as 30nm. It provides high sensitivity detection on engineered substrates and has a significant throughput increase over the prior-generation tool. It offers a single tool solution for three technology nodes and has comprehensive wafer surface inspection capabilities. It also enables faster root-cause analysis with improved coordinate accuracy and real-time defect classification capability.
    문서

    문서 없음

    KLA

    SURFSCAN SP2

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    검증됨

    카테고리

    Defect Inspection
    마지막 검증일: 30일 이상 전
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    13216


    웨이퍼 사이즈:

    12"/300mm


    빈티지:

    2010

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    유사 등재물
    모두 보기
    KLA SURFSCAN SP2
    KLASURFSCAN SP2Defect Inspection
    빈티지: 0조건: 중고
    마지막 검증일18일 전

    KLA

    SURFSCAN SP2

    verified-listing-icon

    검증됨

    카테고리

    Defect Inspection
    마지막 검증일: 30일 이상 전
    listing-photo-5-qWUsZ0zEeUcrwJS9Kzi0xP8FWJkbHwpCzmP0A10YA-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    13216


    웨이퍼 사이즈:

    12"/300mm


    빈티지:

    2010


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    Particle Measurement
    환경 설정
    Process: BAREINSP Tool config is based on original PO, please verify tool details at tool inspection STANDARD SPECIFICATIONS     Windows System    Windows XP SP3 Main S/W       NGS 5.4 SR3 HF3 Wafer Size    300mm SEMI Notch Carrier  3 AdvanTag SW CID, Phx, Shinko (load port)  8 user-configurable LEDs to display the loadport status  Load/unload button for manual delivery hand-off  Cassette / wafer mapping which allows the tool to generate a wafer map of the 300mm FOUP and detect wafer presence, empty slots and cross-slotted wafer. The wafer map can be displayed on the user screen and sent to a SECS host. Facilities  Power: 208 VAC, 3W-N  CDA: > 28.3 Nl/min, > 6.6791 kg/cm2  Vac: > 28.317 l/min, > -700 mm Hg Chamber  Powder Coat Panels Kit  200/300mm Vacuum option  Optical Filter Load port    Vacuum 300mm Dual FIMS Application  2mm Edge Exclusion  Oblique Incidence Illumination (High / Standard / Low)  Normal Incidence Illumination (High / Standard / Low)  Enhanced XY Coordinates  IDM  SP2  Standard Classification package  LPD-N Classification  LPD-ES classification  Grading and Sorting  Spatial Filter (20 degree)  Spatial Filter (40 degree)  Spatial filter (rough films)  Spatial filter (Back)  High Sensitivity Inspect Mode  High Throughput Inspect Mode Options  Haze  Haze Normalization  Haze Analysis  IC/OEM Mfg Surf Quality Recipe Wafer size.    300mm XY Calibration Wafer with first Article HARDWARE CONFIGURATION     Others    5 Color Light Tower (RBYGW) Ethernet  NFS Client  E84 enabled for OHT & AGV/RGV  E87 (Based on E39)  GEM/SECS and HSMS  E40/ E94/ E90 / E116 Handler    Secondary UI, Phoenix, SP2 Main Computer  Intel®Xeon™ CPU 3.20GHz  3.5 GB RAM Memory  DVD- ROM  Mouse  Keyboard  3.5" Floppy  NGS application software FEC computer  Intel®Pentium®4 CPU  512 MB RAM Memory                                                                                                    Damage/Missing parts list Please inspect tool to reconfirm
    OEM 모델 설명
    The Surfscan SP2 is an unpatterned wafer surface inspection tool that uses UV laser technology, darkfield optics, and advanced algorithms to detect defects as small as 30nm. It provides high sensitivity detection on engineered substrates and has a significant throughput increase over the prior-generation tool. It offers a single tool solution for three technology nodes and has comprehensive wafer surface inspection capabilities. It also enables faster root-cause analysis with improved coordinate accuracy and real-time defect classification capability.
    문서

    문서 없음

    유사 등재물
    모두 보기
    KLA SURFSCAN SP2
    KLA
    SURFSCAN SP2
    Defect Inspection빈티지: 0조건: 중고마지막 검증일: 18일 전
    KLA SURFSCAN SP2
    KLA
    SURFSCAN SP2
    Defect Inspection빈티지: 2010조건: 중고마지막 검증일: 30일 이상 전
    KLA SURFSCAN SP2
    KLA
    SURFSCAN SP2
    Defect Inspection빈티지: 0조건: 개조됨마지막 검증일: 30일 이상 전