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KLA SURFSCAN SP3
  • KLA SURFSCAN SP3
  • KLA SURFSCAN SP3
  • KLA SURFSCAN SP3
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OEM 모델 설명
The Surfscan® SP3 is an unpatterned wafer inspection tool available in 450mm, 300mm, and 300mm/450mm bridge tool configurations. It uses deep ultra-violet (DUV) sensitivity and has a throughput up to three times that of its predecessor. It can detect critical defects and surface quality issues for IC, OEM, and substrate manufacturing at the 2Xnm design node. The tool also includes an integrated SURFmonitor module that characterizes and measures surface quality. It has flexible configurations and a reliable, extendible architecture. It is used for qualification and monitoring of process tools for the 2Xnm design node within the IC fab, as well as serving as a lithography process tool monitor. The Surfscan SP3 can also be used for incoming wafer qualification, inline process control, final wafer qualification, process tool qualification, and as a process uniformity monitor.
문서

문서 없음

카테고리
Defect Inspection

마지막 검증일: 60일 이상 전

주요 품목 세부 정보

조건:

Refurbished


작동 상태:

알 수 없음


제품 ID:

87269


웨이퍼 사이즈:

12"/300mm


빈티지:

알 수 없음


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

KLA

SURFSCAN SP3

verified-listing-icon
검증됨
카테고리
Defect Inspection
마지막 검증일: 60일 이상 전
listing-photo-91ae7526778c492797909f7186678c4d-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
주요 품목 세부 정보

조건:

Refurbished


작동 상태:

알 수 없음


제품 ID:

87269


웨이퍼 사이즈:

12"/300mm


빈티지:

알 수 없음


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음
환경 설정
환경 설정 없음
OEM 모델 설명
The Surfscan® SP3 is an unpatterned wafer inspection tool available in 450mm, 300mm, and 300mm/450mm bridge tool configurations. It uses deep ultra-violet (DUV) sensitivity and has a throughput up to three times that of its predecessor. It can detect critical defects and surface quality issues for IC, OEM, and substrate manufacturing at the 2Xnm design node. The tool also includes an integrated SURFmonitor module that characterizes and measures surface quality. It has flexible configurations and a reliable, extendible architecture. It is used for qualification and monitoring of process tools for the 2Xnm design node within the IC fab, as well as serving as a lithography process tool monitor. The Surfscan SP3 can also be used for incoming wafer qualification, inline process control, final wafer qualification, process tool qualification, and as a process uniformity monitor.
문서

문서 없음