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KLA VIPER 2430
  • KLA VIPER 2430
  • KLA VIPER 2430
  • KLA VIPER 2430
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환경 설정
Defect Inspection
OEM 모델 설명
In 2001, we introduced the 2430 macro ADI series, which brought the benefits of the 2401's advanced analysis capabilities, high throughput and advanced detection algorithms to 300 mm production. Macro defects, which can ruin the entire wafer, are especially costly to chipmakers in 300 mm production, since more than twice the number of die are at risk with these larger wafers as compared to 200 mm wafers. The 2430 is the first automated macro ADI system on the market to be fully compliant with I300I standards for complete integration and rapid deployment in 300 mm fabs. Backside Wafer Inspection
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검증됨

카테고리
Defect Inspection

마지막 검증일: 60일 이상 전

주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

116693


웨이퍼 사이즈:

12"/300mm


빈티지:

2004


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

KLA

VIPER 2430

verified-listing-icon
검증됨
카테고리
Defect Inspection
마지막 검증일: 60일 이상 전
listing-photo-5c9e6de7311449de90118fe1368e4d94-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

116693


웨이퍼 사이즈:

12"/300mm


빈티지:

2004


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음
환경 설정
Defect Inspection
OEM 모델 설명
In 2001, we introduced the 2430 macro ADI series, which brought the benefits of the 2401's advanced analysis capabilities, high throughput and advanced detection algorithms to 300 mm production. Macro defects, which can ruin the entire wafer, are especially costly to chipmakers in 300 mm production, since more than twice the number of die are at risk with these larger wafers as compared to 200 mm wafers. The 2430 is the first automated macro ADI system on the market to be fully compliant with I300I standards for complete integration and rapid deployment in 300 mm fabs. Backside Wafer Inspection
문서

문서 없음