설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The Dragonfly G3 system is a unique 2D imaging technology that provides fast, reliable inspection for sub-micron defects. It is designed to meet today’s R&D needs and tomorrow’s production demands. The system uses Onto Innovation’s patented Truebump® Technology, which combines multiple 3D metrology techniques to deliver accurate 100% bump height metrology and coplanarity. The Dragonfly G3 system also offers Clearfind® Technology for non-visual residue detection and is tightly integrated with control and analytical software for real-time analysis and review. It is suitable for a wide range of applications, including micro bumps, large die, multi-chip packages, reconstituted wafers, redistribution layers (RDL), CMOS image sensors (CIS), MEMS, and more. The system also offers flexible platform options, such as IR defect inspection and review, large die and package support, substrate handling options, waferless recipe creation, rule-based binning and classification, online and offline review capability, and more. Overall, the Dragonfly G3 system is a powerful tool for improving yields through exploratory data analysis down to the bump level.문서
문서 없음
카테고리
Defect Inspection
마지막 검증일: 7일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Running
제품 ID:
142461
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ONTO / RUDOLPH / AUGUST
DRAGONFLY G3
카테고리
Defect Inspection
마지막 검증일: 7일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Running
제품 ID:
142461
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The Dragonfly G3 system is a unique 2D imaging technology that provides fast, reliable inspection for sub-micron defects. It is designed to meet today’s R&D needs and tomorrow’s production demands. The system uses Onto Innovation’s patented Truebump® Technology, which combines multiple 3D metrology techniques to deliver accurate 100% bump height metrology and coplanarity. The Dragonfly G3 system also offers Clearfind® Technology for non-visual residue detection and is tightly integrated with control and analytical software for real-time analysis and review. It is suitable for a wide range of applications, including micro bumps, large die, multi-chip packages, reconstituted wafers, redistribution layers (RDL), CMOS image sensors (CIS), MEMS, and more. The system also offers flexible platform options, such as IR defect inspection and review, large die and package support, substrate handling options, waferless recipe creation, rule-based binning and classification, online and offline review capability, and more. Overall, the Dragonfly G3 system is a powerful tool for improving yields through exploratory data analysis down to the bump level.문서
문서 없음