설명
-Includes WHS (wafer handling station) -Installed and running환경 설정
환경 설정 없음OEM 모델 설명
The NSX-100 is a high-throughput and repeatable macro defect inspection solution that is part of the NSX® Series. It is designed to detect macro defects (defects 0.5 micron and larger) that can occur during various stages of device manufacturing, such as wafer manufacturing, probing, bumping, dicing, or general handling. These defects can have a significant impact on the quality of microelectronic devices. The NSX-100 provides fast and consistent 2D bump inspection and valuable process information for enhanced process control and product consistency. This information can be transferred to Discover™, Rudolph’s yield management software, for further analysis and review. The NSX-100 is suitable for 200 mm applications and has time-tested applications in various markets, including semiconductor, optoelectronics, wafer bumping, data storage, micro electromechanical systems (MEMS), and micro display markets. It offers automated, 100% advanced macro defect inspection to ensure quality assurance. NSX-100 series systems are able to inspect as many as 97 wafers-per-hour.문서
문서 없음
카테고리
Defect Inspection
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
130985
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ONTO / RUDOLPH / AUGUST
NSX-100
카테고리
Defect Inspection
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
130985
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
-Includes WHS (wafer handling station) -Installed and running환경 설정
환경 설정 없음OEM 모델 설명
The NSX-100 is a high-throughput and repeatable macro defect inspection solution that is part of the NSX® Series. It is designed to detect macro defects (defects 0.5 micron and larger) that can occur during various stages of device manufacturing, such as wafer manufacturing, probing, bumping, dicing, or general handling. These defects can have a significant impact on the quality of microelectronic devices. The NSX-100 provides fast and consistent 2D bump inspection and valuable process information for enhanced process control and product consistency. This information can be transferred to Discover™, Rudolph’s yield management software, for further analysis and review. The NSX-100 is suitable for 200 mm applications and has time-tested applications in various markets, including semiconductor, optoelectronics, wafer bumping, data storage, micro electromechanical systems (MEMS), and micro display markets. It offers automated, 100% advanced macro defect inspection to ensure quality assurance. NSX-100 series systems are able to inspect as many as 97 wafers-per-hour.문서
문서 없음