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ONTO / RUDOLPH / AUGUST NSX-95
    설명
    No Objective lens
    환경 설정
    환경 설정 없음
    OEM 모델 설명
    The NSX-95 is an automated inspection system that provides fast and consistent 100% 2D bump inspection and 3D bump height inspection. It ensures the quality of every process step and provides process and defect information for enhanced process control and product consistency. The system also features YieldPilot enhanced data and defect analysis. It has proven applications in semiconductor, optoelectronics, wafer bumping, data storage, micro electromechanical systems (MEMS) and micro display markets. The NSX-95 has a throughput of 43 wafers per hour for 12"/300mm wafers, 63 wafers per hour for 8"/200mm wafers, 76 wafers per hour for 6"/150mm wafers, 83 wafers per hour for 5"/150mm wafers, and 89 wafers per hour for 4"/100mm wafers.
    문서

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    ONTO / RUDOLPH / AUGUST

    NSX-95

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    검증됨

    카테고리

    Defect Inspection
    마지막 검증일: 60일 이상 전
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    43778


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    2006

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    유사 등재물
    모두 보기
    ONTO / RUDOLPH / AUGUST NSX-95
    ONTO / RUDOLPH / AUGUSTNSX-95Defect Inspection
    빈티지: 0조건: 중고
    마지막 검증일60일 이상 전

    ONTO / RUDOLPH / AUGUST

    NSX-95

    verified-listing-icon

    검증됨

    카테고리

    Defect Inspection
    마지막 검증일: 60일 이상 전
    listing-photo-950574466fb440c19757807cc6c137d0-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    43778


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    2006


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    No Objective lens
    환경 설정
    환경 설정 없음
    OEM 모델 설명
    The NSX-95 is an automated inspection system that provides fast and consistent 100% 2D bump inspection and 3D bump height inspection. It ensures the quality of every process step and provides process and defect information for enhanced process control and product consistency. The system also features YieldPilot enhanced data and defect analysis. It has proven applications in semiconductor, optoelectronics, wafer bumping, data storage, micro electromechanical systems (MEMS) and micro display markets. The NSX-95 has a throughput of 43 wafers per hour for 12"/300mm wafers, 63 wafers per hour for 8"/200mm wafers, 76 wafers per hour for 6"/150mm wafers, 83 wafers per hour for 5"/150mm wafers, and 89 wafers per hour for 4"/100mm wafers.
    문서

    문서 없음

    유사 등재물
    모두 보기
    ONTO / RUDOLPH / AUGUST NSX-95
    ONTO / RUDOLPH / AUGUST
    NSX-95
    Defect Inspection빈티지: 0조건: 중고마지막 검증일: 60일 이상 전
    ONTO / RUDOLPH / AUGUST NSX-95
    ONTO / RUDOLPH / AUGUST
    NSX-95
    Defect Inspection빈티지: 0조건: 중고마지막 검증일: 60일 이상 전
    ONTO / RUDOLPH / AUGUST NSX-95
    ONTO / RUDOLPH / AUGUST
    NSX-95
    Defect Inspection빈티지: 0조건: 중고마지막 검증일: 60일 이상 전