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Rudolph Technologies (formerly RVSI / August Technology) LS-7700 Laser Scanning Inspection System Function: Fully automated wafer surface inspection tool for patterned or unpatterned semiconductor wafers Type: Laser-based defect inspection and surface mapping system Common Uses: Detecting micro-scratches, particles, pattern defects, and residue on wafers Inline or offline inspection during front-end and mid-end semiconductor processing Quality assurance before lithography, CMP, or dicing Laser Scan Head The black laser-marked enclosure with the DANGER – LASER RADIATION” sticker houses a precision laser interferometer scanner capable of sub-micron detection. Optical Table & Motion Stage Granite base with dual-linear rail servo motion for X-Y wafer translation under the scanning beam. Wafer Handling Arm Automated wafer loader compatible with FOUPs or open cassettes (depending on config). Some LS-7700 systems are integrated with cassette elevators. Control Panel Includes the manual “TRAY POSITIONER / CLAMPING switch — in this configuration it likely assists in wafer or stage positioning during service. Inspection Optics Uses confocal or laser scatter detection to capture surface topology and defect maps. Environmental Enclosure Large glass-window housing isolates the laser-scanning area for clean operation. SMAC Actuators Precision Z-axis or focus mechanisms (seen in your close-up labeled SMAC PNP0415”), typical of Z-stage alignment under laser beam. Wafer Sizes Supported 100 mm – 300 mm Defect Sensitivity ~0.2 µm (depending on configuration) Throughput 60–90 wafers/hour typical Light Source He-Ne or solid-state laser Scan Mechanism Precision galvanometer-based scanning + synchronized stage motion Interface SECS/GEM compliant Dimensions / Weight ~1.6 m W × 1.3 m D × 1.7 m H / ~900 kg Power 200–230 VAC, 50/60 Hz, 3 kVA Cooling / Air CDA (Clean Dry Air) and vacuum ports required