설명
Cu Barrier Seed depostion환경 설정
Software Version: 5.65 CIM: SECS/GEM Process: TFM_Cu Barrier Seed_NovellusOEM 모델 설명
The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.문서
문서 없음
LAM RESEARCH / NOVELLUS
INOVA
검증됨
카테고리
Deposition
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
50644
웨이퍼 사이즈:
12"/300mm
빈티지:
2014
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
LAM RESEARCH / NOVELLUS
INOVA
검증됨
카테고리
Deposition
마지막 검증일: 16일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
50644
웨이퍼 사이즈:
12"/300mm
빈티지:
2014
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Cu Barrier Seed depostion환경 설정
Software Version: 5.65 CIM: SECS/GEM Process: TFM_Cu Barrier Seed_NovellusOEM 모델 설명
The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.문서
문서 없음