설명
Cu Barrier Seed depostion환경 설정
Cu Barrier Seed depostionOEM 모델 설명
The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.문서
문서 없음
LAM RESEARCH / NOVELLUS
INOVA
검증됨
카테고리
Deposition
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
49114
웨이퍼 사이즈:
12"/300mm
빈티지:
2014
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
LAM RESEARCH / NOVELLUS
INOVA
검증됨
카테고리
Deposition
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
49114
웨이퍼 사이즈:
12"/300mm
빈티지:
2014
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Cu Barrier Seed depostion환경 설정
Cu Barrier Seed depostionOEM 모델 설명
The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.문서
문서 없음