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환경 설정 없음OEM 모델 설명
The AD838L is a series of die bonders from ASMPT. It has an exclusive material handling capability, dragging-free indexing, and an advanced bond head design with patented technology that achieves high UPH. It can handle extra large substrates up to 300 mm x 100 mm and has a high precision bonding option that achieves ±15 μm @ 3σ XY placement accuracy.문서
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ASM
AD838L
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
78399
웨이퍼 사이즈:
알 수 없음
빈티지:
2017
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설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The AD838L is a series of die bonders from ASMPT. It has an exclusive material handling capability, dragging-free indexing, and an advanced bond head design with patented technology that achieves high UPH. It can handle extra large substrates up to 300 mm x 100 mm and has a high precision bonding option that achieves ±15 μm @ 3σ XY placement accuracy.문서
문서 없음