AD8912
개요
AD8912 epoxy die bonder for 300mm wafers. With its capability to handle up to 300mm wafers, fully automatic operation, epoxy writer, pre and post bond inspection and wafer mapping.
활성 등재물
12
서비스
검사, 보험, 감정, 물류
AD8912 epoxy die bonder for 300mm wafers. With its capability to handle up to 300mm wafers, fully automatic operation, epoxy writer, pre and post bond inspection and wafer mapping.
12
검사, 보험, 감정, 물류