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2100
개요
The ESEC 2100 supports various bonding methods, such as eutectic solder bonding, adhesive bonding, or thermo-compression bonding, depending on the specific configuration or options chosen. Depending on the specific model or version, the ESEC 2100 may offer additional features such as multi-die bonding, flip chip bonding, or customized configurations to meet specific customer requirements or application needs.
활성 등재물
0
서비스
검사, 보험, 감정, 물류
상위 등재물
BESI / ESEC
2100
Die Bonders / Sorters / Attachers빈티지: 2017조건: 중고마지막 검증일60일 이상 전BESI / ESEC
2100
Die Bonders / Sorters / Attachers빈티지: 2021조건: 중고마지막 검증일60일 이상 전BESI / ESEC
2100
Die Bonders / Sorters / Attachers빈티지: 2017조건: 중고마지막 검증일60일 이상 전BESI / ESEC
2100
Die Bonders / Sorters / Attachers빈티지: 2017조건: 중고마지막 검증일60일 이상 전
