설명
Flip Chip Attach환경 설정
환경 설정 없음OEM 모델 설명
The ESEC 2100 supports various bonding methods, such as eutectic solder bonding, adhesive bonding, or thermo-compression bonding, depending on the specific configuration or options chosen. Depending on the specific model or version, the ESEC 2100 may offer additional features such as multi-die bonding, flip chip bonding, or customized configurations to meet specific customer requirements or application needs.문서
문서 없음
BESI / ESEC
2100
검증됨
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 12일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Idle
제품 ID:
116382
웨이퍼 사이즈:
8"/200mm
빈티지:
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
BESI / ESEC
2100
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 12일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Idle
제품 ID:
116382
웨이퍼 사이즈:
8"/200mm
빈티지:
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Flip Chip Attach환경 설정
환경 설정 없음OEM 모델 설명
The ESEC 2100 supports various bonding methods, such as eutectic solder bonding, adhesive bonding, or thermo-compression bonding, depending on the specific configuration or options chosen. Depending on the specific model or version, the ESEC 2100 may offer additional features such as multi-die bonding, flip chip bonding, or customized configurations to meet specific customer requirements or application needs.문서
문서 없음