설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The Die Bonder 2100 xP from Esec achieves with its revolutionary machine layout an increase in productivity of more than 80% in relation to conventional solutions. The rotational movement utilized by the new Die Bonder 2100 xP from Esec manages four chip placements per second with a precision of 5 µm - a leading-edge achievement in robotics and an absolutely stellar performance in the industry.문서
문서 없음
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 어제
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
127774
웨이퍼 사이즈:
알 수 없음
빈티지:
2010
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / ESEC
2100 xP
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 어제
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
127774
웨이퍼 사이즈:
알 수 없음
빈티지:
2010
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The Die Bonder 2100 xP from Esec achieves with its revolutionary machine layout an increase in productivity of more than 80% in relation to conventional solutions. The rotational movement utilized by the new Die Bonder 2100 xP from Esec manages four chip placements per second with a precision of 5 µm - a leading-edge achievement in robotics and an absolutely stellar performance in the industry.문서
문서 없음