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6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
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BESI / ESEC 2100 xP
    설명
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    환경 설정
    환경 설정 없음
    OEM 모델 설명
    The Die Bonder 2100 xP from Esec achieves with its revolutionary machine layout an increase in productivity of more than 80% in relation to conventional solutions. The rotational movement utilized by the new Die Bonder 2100 xP from Esec manages four chip placements per second with a precision of 5 µm - a leading-edge achievement in robotics and an absolutely stellar performance in the industry.
    문서

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    BESI / ESEC

    2100 xP

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    검증됨

    카테고리
    Die Bonders / Sorters / Attachers

    마지막 검증일: 60일 이상 전

    주요 품목 세부 정보

    조건:

    Refurbished


    작동 상태:

    알 수 없음


    제품 ID:

    27595


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    2012


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    유사 등재물
    모두 보기
    BESI / ESEC 2100 xP

    BESI / ESEC

    2100 xP

    Die Bonders / Sorters / Attachers
    빈티지: 2012조건: 개조됨
    마지막 검증일60일 이상 전

    BESI / ESEC

    2100 xP

    verified-listing-icon
    검증됨
    카테고리
    Die Bonders / Sorters / Attachers
    마지막 검증일: 60일 이상 전
    listing-photo-9471bff10db44a44a6057fb3a0bd630b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1705/9471bff10db44a44a6057fb3a0bd630b/399db9ddf9b948699d2509c3ce5da0cc_1a15e87e2dd6471f8482fbe2fccf34f61105c_f.jpeg
    listing-photo-9471bff10db44a44a6057fb3a0bd630b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1705/9471bff10db44a44a6057fb3a0bd630b/2ccfd973c2cf474ba5e5ba7493d98daf_7a6f53d5e44d45e8bb5f55111221f8e11105c_f.jpeg
    listing-photo-9471bff10db44a44a6057fb3a0bd630b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1705/9471bff10db44a44a6057fb3a0bd630b/3c2ed6e32fac42bd97e50930a997e011_dba911cdab7c44cba0e09ed362b2dfd91105c_f.jpeg
    주요 품목 세부 정보

    조건:

    Refurbished


    작동 상태:

    알 수 없음


    제품 ID:

    27595


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    2012


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    설명 없음
    환경 설정
    환경 설정 없음
    OEM 모델 설명
    The Die Bonder 2100 xP from Esec achieves with its revolutionary machine layout an increase in productivity of more than 80% in relation to conventional solutions. The rotational movement utilized by the new Die Bonder 2100 xP from Esec manages four chip placements per second with a precision of 5 µm - a leading-edge achievement in robotics and an absolutely stellar performance in the industry.
    문서

    문서 없음

    유사 등재물
    모두 보기
    BESI / ESEC 2100 xP

    BESI / ESEC

    2100 xP

    Die Bonders / Sorters / Attachers빈티지: 2012조건: 개조됨마지막 검증일:60일 이상 전