설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership.문서
문서 없음
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 오늘
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
127776
웨이퍼 사이즈:
알 수 없음
빈티지:
2016
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
BESI / ESEC
2100 hS
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 오늘
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
127776
웨이퍼 사이즈:
알 수 없음
빈티지:
2016
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership.문서
문서 없음