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BESI / DATACON DS9000e
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    OEM 모델 설명
    The Datacon DS9000e is a high speed fully automatic die sorter with output to a frame or carrier. It handles any wafer sizes up to 300 mm and can therefore reconstruct wafers to different output form factors. This enables the transition to larger wafer formats without having to reinvest in downstream packaging equipment. Besides wafers, the DS9000e handle a variety of chip carriers such as waffle pack, JEDEC tray, and Gel-Pak.
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    BESI / DATACON

    DS9000e

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    검증됨

    카테고리
    Die Bonders / Sorters / Attachers

    마지막 검증일: 60일 이상 전

    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    97801


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    알 수 없음


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    유사 등재물
    모두 보기
    BESI / DATACON DS9000e

    BESI / DATACON

    DS9000e

    Die Bonders / Sorters / Attachers
    빈티지: 0조건: 중고
    마지막 검증일60일 이상 전

    BESI / DATACON

    DS9000e

    verified-listing-icon
    검증됨
    카테고리
    Die Bonders / Sorters / Attachers
    마지막 검증일: 60일 이상 전
    listing-photo-7fc446efe8df4889928275ea3581fed1-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    97801


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    알 수 없음


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    설명 없음
    환경 설정
    환경 설정 없음
    OEM 모델 설명
    The Datacon DS9000e is a high speed fully automatic die sorter with output to a frame or carrier. It handles any wafer sizes up to 300 mm and can therefore reconstruct wafers to different output form factors. This enables the transition to larger wafer formats without having to reinvest in downstream packaging equipment. Besides wafers, the DS9000e handle a variety of chip carriers such as waffle pack, JEDEC tray, and Gel-Pak.
    문서

    문서 없음

    유사 등재물
    모두 보기
    BESI / DATACON DS9000e

    BESI / DATACON

    DS9000e

    Die Bonders / Sorters / Attachers빈티지: 0조건: 중고마지막 검증일:60일 이상 전