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6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
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DISCO DDS2300
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    환경 설정
    환경 설정 없음
    OEM 모델 설명
    2008 Developed the "DDS2300" fully automatic die separator. Improves the cut quality of thin wafers with DAF In separation process for thin wafers with DAF (Die Attach Film), there are issues such as DAF burring forming on the cut surface when full-cut dicing is performed and pickup errors during die bonding. Using the DDS2300 in the dicing process improves DAF cut quality and provides solutions for these issues.
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    DISCO

    DDS2300

    verified-listing-icon

    검증됨

    카테고리
    Die Bonders / Sorters / Attachers

    마지막 검증일: 60일 이상 전

    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    63989


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    알 수 없음


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    유사 등재물
    모두 보기
    DISCO DDS2300

    DISCO

    DDS2300

    Die Bonders / Sorters / Attachers
    빈티지: 0조건: 중고
    마지막 검증일60일 이상 전

    DISCO

    DDS2300

    verified-listing-icon
    검증됨
    카테고리
    Die Bonders / Sorters / Attachers
    마지막 검증일: 60일 이상 전
    listing-photo-9888a61d07f04d81b1661fbfbff21f6f-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    63989


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    알 수 없음


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    설명 없음
    환경 설정
    환경 설정 없음
    OEM 모델 설명
    2008 Developed the "DDS2300" fully automatic die separator. Improves the cut quality of thin wafers with DAF In separation process for thin wafers with DAF (Die Attach Film), there are issues such as DAF burring forming on the cut surface when full-cut dicing is performed and pickup errors during die bonding. Using the DDS2300 in the dicing process improves DAF cut quality and provides solutions for these issues.
    문서

    문서 없음

    유사 등재물
    모두 보기
    DISCO DDS2300

    DISCO

    DDS2300

    Die Bonders / Sorters / Attachers빈티지: 0조건: 중고마지막 검증일:60일 이상 전