설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
High accuracy die bonder with the 2-in-1 concept, which supports a stacked die packaging with DAF process and general-purpose products of paste process. It can be switched easily between direct mode and parallel mode, which enables flexible production that supports the optimal process. Productivity Use of intermediate stage ensures high quality and high productivity Multilayering support • Improved accuracy of bonding placement • Integrated vision system with position correction • Clean operation support reduces particle contamination during multilayering Thin die bonding technology • Multi-stage pickup enables thin die pickup operation • Wide variety of bonding sequences helps to reduce die stresses문서
문서 없음
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
133517
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
FASFORD
DB830plus+
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
133517
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
High accuracy die bonder with the 2-in-1 concept, which supports a stacked die packaging with DAF process and general-purpose products of paste process. It can be switched easily between direct mode and parallel mode, which enables flexible production that supports the optimal process. Productivity Use of intermediate stage ensures high quality and high productivity Multilayering support • Improved accuracy of bonding placement • Integrated vision system with position correction • Clean operation support reduces particle contamination during multilayering Thin die bonding technology • Multi-stage pickup enables thin die pickup operation • Wide variety of bonding sequences helps to reduce die stresses문서
문서 없음