설명
Die / Hybrid Bonder Power Spec (V/kW) - 380V 4.2KW Dimensions L×W×H (mm) - 1815*1215*2050 Weight (kg) - 2100 Accessories Completeness - Main machine +IUPC loading and unloading환경 설정
Cell Footprint - ≈1800 mm class Placement Heads - Same platform (Infotech Die/Hybrid Bonder) Wafer Handling - Same platform (Infotech Die/Hybrid Bonder) Wafer Changer & Feeder -Same platform (Infotech Die/Hybrid Bonder) Placement Accuracy - Same platform (Infotech Die/Hybrid Bonder) Process Capability - Same platform (Infotech Die/Hybrid Bonder) Workpiece Transport - Same platform (Infotech Die/Hybrid Bonder) Perform Feeding - Same platform (Infotech Die/Hybrid Bonder) Heating & Bond Force - Same platform (Infotech Die/Hybrid Bonder) System Interface - Same platform (Infotech Die/Hybrid Bonder) Standard Features - Same platform (Infotech Die/Hybrid Bonder)OEM 모델 설명
Die Bonder문서
문서 없음
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 어제
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
154511
웨이퍼 사이즈:
알 수 없음
빈티지:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
INFOTECH AUTOMATION
IC-1800
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 어제
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
154511
웨이퍼 사이즈:
알 수 없음
빈티지:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Die / Hybrid Bonder Power Spec (V/kW) - 380V 4.2KW Dimensions L×W×H (mm) - 1815*1215*2050 Weight (kg) - 2100 Accessories Completeness - Main machine +IUPC loading and unloading환경 설정
Cell Footprint - ≈1800 mm class Placement Heads - Same platform (Infotech Die/Hybrid Bonder) Wafer Handling - Same platform (Infotech Die/Hybrid Bonder) Wafer Changer & Feeder -Same platform (Infotech Die/Hybrid Bonder) Placement Accuracy - Same platform (Infotech Die/Hybrid Bonder) Process Capability - Same platform (Infotech Die/Hybrid Bonder) Workpiece Transport - Same platform (Infotech Die/Hybrid Bonder) Perform Feeding - Same platform (Infotech Die/Hybrid Bonder) Heating & Bond Force - Same platform (Infotech Die/Hybrid Bonder) System Interface - Same platform (Infotech Die/Hybrid Bonder) Standard Features - Same platform (Infotech Die/Hybrid Bonder)OEM 모델 설명
Die Bonder문서
문서 없음