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INFOTECH AUTOMATION IC-1600
    설명
    Same platform (Infotech Die/Hybrid Bonder) Power Spec (V/kW) - 380V 3KW Dimensions L×W×H (mm) - 1614*1215*2050 Weight (kg) - 1690 Accessories Completeness - Main machine +IUPC loading and unloading
    환경 설정
    Cell Footprint - ≈1600 mm class Placement Heads - Same platform (Infotech Die/Hybrid Bonder) Wafer Handling - Same platform (Infotech Die/Hybrid Bonder) Wafer Changer & Feeder -Same platform (Infotech Die/Hybrid Bonder) Placement Accuracy - Same platform (Infotech Die/Hybrid Bonder) Process Capability - Same platform (Infotech Die/Hybrid Bonder) Workpiece Transport - Same platform (Infotech Die/Hybrid Bonder) Perform Feeding - Same platform (Infotech Die/Hybrid Bonder) Heating & Bond Force - Same platform (Infotech Die/Hybrid Bonder) System Interface - Same platform (Infotech Die/Hybrid Bonder) Standard Features - Same platform (Infotech Die/Hybrid Bonder)
    OEM 모델 설명
    Die Bonder
    문서

    문서 없음

    INFOTECH AUTOMATION

    IC-1600

    verified-listing-icon

    검증됨

    카테고리
    Die Bonders / Sorters / Attachers

    마지막 검증일: 어제

    주요 품목 세부 정보
    조건:

    Used

    작동 상태:

    알 수 없음

    제품 ID:

    153371

    웨이퍼 사이즈:

    알 수 없음

    빈티지:

    2022

    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    유사 등재물
    모두 보기
    INFOTECH AUTOMATION IC-1600

    INFOTECH AUTOMATION

    IC-1600

    Die Bonders / Sorters / Attachers
    빈티지: 2022조건: 중고
    마지막 검증일어제
    INFOTECH AUTOMATION IC-1600

    INFOTECH AUTOMATION

    IC-1600

    Die Bonders / Sorters / Attachers
    빈티지: 2022조건: 중고
    마지막 검증일어제

    INFOTECH AUTOMATION

    IC-1600

    verified-listing-icon
    검증됨
    카테고리
    Die Bonders / Sorters / Attachers
    마지막 검증일: 어제
    listing-photo-81b6aab50738400080fc41aa47c91d89-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/93230/81b6aab50738400080fc41aa47c91d89/c313dcb617d940ff9f1dfe5de2c0c709_1_mw.jpg
    listing-photo-81b6aab50738400080fc41aa47c91d89-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/93230/81b6aab50738400080fc41aa47c91d89/d1b9b6ac9cf24234a9709c402b92615e_2_mw.png
    주요 품목 세부 정보
    조건:

    Used

    작동 상태:

    알 수 없음

    제품 ID:

    153371

    웨이퍼 사이즈:

    알 수 없음

    빈티지:

    2022

    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    Same platform (Infotech Die/Hybrid Bonder) Power Spec (V/kW) - 380V 3KW Dimensions L×W×H (mm) - 1614*1215*2050 Weight (kg) - 1690 Accessories Completeness - Main machine +IUPC loading and unloading
    환경 설정
    Cell Footprint - ≈1600 mm class Placement Heads - Same platform (Infotech Die/Hybrid Bonder) Wafer Handling - Same platform (Infotech Die/Hybrid Bonder) Wafer Changer & Feeder -Same platform (Infotech Die/Hybrid Bonder) Placement Accuracy - Same platform (Infotech Die/Hybrid Bonder) Process Capability - Same platform (Infotech Die/Hybrid Bonder) Workpiece Transport - Same platform (Infotech Die/Hybrid Bonder) Perform Feeding - Same platform (Infotech Die/Hybrid Bonder) Heating & Bond Force - Same platform (Infotech Die/Hybrid Bonder) System Interface - Same platform (Infotech Die/Hybrid Bonder) Standard Features - Same platform (Infotech Die/Hybrid Bonder)
    OEM 모델 설명
    Die Bonder
    문서

    문서 없음

    유사 등재물
    모두 보기
    INFOTECH AUTOMATION IC-1600

    INFOTECH AUTOMATION

    IC-1600

    Die Bonders / Sorters / Attachers빈티지: 2022조건: 중고마지막 검증일:어제
    INFOTECH AUTOMATION IC-1600

    INFOTECH AUTOMATION

    IC-1600

    Die Bonders / Sorters / Attachers빈티지: 2022조건: 중고마지막 검증일:어제