메인 콘텐츠로 건너뛰기
6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
Moov logo

6" Fab For Sale from Moov - Click Here to Learn More
Moov Icon
PANASONIC MD-P200
    설명
    설명 없음
    환경 설정
    환경 설정 없음
    OEM 모델 설명
    MD-P200 is a device bonder for high-speed, high-quality bonding of bare ICs for cutting-edge devices. The basic structure comprises fixed-point pickup and mounting that supports supply of wafers up to ⌀200 mm. In response to innovations in manufacturing, such as multi-functionality, miniaturization and reduced thickness, and multi-layering, various functions such as flip-chip bonding, thermosonic bonding, DAF bonding, and stacked bonding, can also be selected. Assembly of high value-added devices such as RF modules, MEMS, power devices, and sensors. Die Bonder
    문서

    PANASONIC

    MD-P200

    verified-listing-icon

    검증됨

    카테고리
    Die Bonders / Sorters / Attachers

    마지막 검증일: 60일 이상 전

    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    75480


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    2021


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    유사 등재물
    모두 보기
    PANASONIC MD-P200

    PANASONIC

    MD-P200

    Die Bonders / Sorters / Attachers
    빈티지: 2021조건: 중고
    마지막 검증일60일 이상 전

    PANASONIC

    MD-P200

    verified-listing-icon
    검증됨
    카테고리
    Die Bonders / Sorters / Attachers
    마지막 검증일: 60일 이상 전
    listing-photo-e39cf61dcd2b48a48285f6368284085d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55278/e39cf61dcd2b48a48285f6368284085d/b3ade7ce335b46d8a5f2b949152cb4f6_21e14ccb689d4506a1aa53a457aa2f2645005c_mw.jpeg
    listing-photo-e39cf61dcd2b48a48285f6368284085d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55278/e39cf61dcd2b48a48285f6368284085d/60f73edf223f4cbe83e3602e6ad56957_fc079d33c9714131a32ab4afad3fe20445005c_mw.jpeg
    listing-photo-e39cf61dcd2b48a48285f6368284085d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55278/e39cf61dcd2b48a48285f6368284085d/08750c8ba1ce487d89e1bf6375fa08b0_d4005bb0777d4bf49187b6009f2b3eb345005c_mw.jpeg
    listing-photo-e39cf61dcd2b48a48285f6368284085d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55278/e39cf61dcd2b48a48285f6368284085d/c2be4d59889049148b87eee0cb3e9f9f_92c6a88e39454ba4adf4bd94192a39fb45005c_mw.jpeg
    listing-photo-e39cf61dcd2b48a48285f6368284085d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55278/e39cf61dcd2b48a48285f6368284085d/bfa0bad88706443eb692ae635fcd3ba2_82c03bb140d84c708f3a92e4b842a94945005c_mw.jpeg
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    75480


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    2021


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    설명 없음
    환경 설정
    환경 설정 없음
    OEM 모델 설명
    MD-P200 is a device bonder for high-speed, high-quality bonding of bare ICs for cutting-edge devices. The basic structure comprises fixed-point pickup and mounting that supports supply of wafers up to ⌀200 mm. In response to innovations in manufacturing, such as multi-functionality, miniaturization and reduced thickness, and multi-layering, various functions such as flip-chip bonding, thermosonic bonding, DAF bonding, and stacked bonding, can also be selected. Assembly of high value-added devices such as RF modules, MEMS, power devices, and sensors. Die Bonder
    문서
    유사 등재물
    모두 보기
    PANASONIC MD-P200

    PANASONIC

    MD-P200

    Die Bonders / Sorters / Attachers빈티지: 2021조건: 중고마지막 검증일:60일 이상 전
    PANASONIC MD-P200

    PANASONIC

    MD-P200

    Die Bonders / Sorters / Attachers빈티지: 2022조건: 중고마지막 검증일:60일 이상 전