메인 콘텐츠로 건너뛰기
6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
Moov logo

6" Fab For Sale from Moov - Click Here to Learn More
Moov Icon
TRESKY 3002/3102
    설명
    설명 없음
    환경 설정
    환경 설정 없음
    OEM 모델 설명
    The T-3002-PRO series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the PRO platform is the industry’s most sophisticated system in its class and with the new PC software even easier to operate. The T-3002-PRO is a Chip Bonder with programmable and motorized Z-axis. It is also equipped with Tresky’s proven die ejector system for pick-up from wafer Die Bonder
    문서

    문서 없음

    TRESKY

    3002/3102

    verified-listing-icon

    검증됨

    카테고리
    Die Bonders / Sorters / Attachers

    마지막 검증일: 60일 이상 전

    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    16458


    웨이퍼 사이즈:

    8"/200mm


    빈티지:

    알 수 없음


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    유사 등재물
    모두 보기
    TRESKY 3002/3102

    TRESKY

    3002/3102

    Die Bonders / Sorters / Attachers
    빈티지: 0조건: 중고
    마지막 검증일60일 이상 전

    TRESKY

    3002/3102

    verified-listing-icon
    검증됨
    카테고리
    Die Bonders / Sorters / Attachers
    마지막 검증일: 60일 이상 전
    listing-photo-FIT4iiIP7gQJy_TJUSVbmtyWbBapWExkw_3buYlq7uo-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/HIRFC8l_oK7h5mJJleGYJLwHwS9yUMInpxob19BPZSA/FIT4iiIP7gQJy_TJUSVbmtyWbBapWExkw_3buYlq7uo/XAQwjaY1Ybp10Xm_TYbFwgwBe3mzWkB4ARqcQT03-6c_20200316_115514_f
    listing-photo-FIT4iiIP7gQJy_TJUSVbmtyWbBapWExkw_3buYlq7uo-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/HIRFC8l_oK7h5mJJleGYJLwHwS9yUMInpxob19BPZSA/FIT4iiIP7gQJy_TJUSVbmtyWbBapWExkw_3buYlq7uo/Z8s9Hr7WYtuliFsQ9JZOFFnv5TANAEdACfITp3pmE9s_20200316_115514_f
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    16458


    웨이퍼 사이즈:

    8"/200mm


    빈티지:

    알 수 없음


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    설명 없음
    환경 설정
    환경 설정 없음
    OEM 모델 설명
    The T-3002-PRO series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the PRO platform is the industry’s most sophisticated system in its class and with the new PC software even easier to operate. The T-3002-PRO is a Chip Bonder with programmable and motorized Z-axis. It is also equipped with Tresky’s proven die ejector system for pick-up from wafer Die Bonder
    문서

    문서 없음

    유사 등재물
    모두 보기
    TRESKY 3002/3102

    TRESKY

    3002/3102

    Die Bonders / Sorters / Attachers빈티지: 0조건: 중고마지막 검증일:60일 이상 전
    TRESKY 3002/3102

    TRESKY

    3002/3102

    Die Bonders / Sorters / Attachers빈티지: 0조건: 중고마지막 검증일:60일 이상 전
    TRESKY 3002/3102

    TRESKY

    3002/3102

    Die Bonders / Sorters / Attachers빈티지: 0조건: 중고마지막 검증일:60일 이상 전