BE Semiconductor Industries N.V. designs, develops, manufactures, markets and services die sorting, flip chip and multi-chip die bonding, packaging and plating equipment for the semiconductor industry's assembly operations.
Founded in 1968, Esec is a leading global manufacturer of die bonding equipment for the semiconductor, telecommunications and smart card industries based in Cham, Switzerland. It also manufactures and services wire bonding systems from its Singapore assembly facility.

BESI / ESEC

The ESEC 2100 FC hS is the third generation of the highly regarded High-Speed Flip Chip platform, designed to handle a wide array of Flip Chip applications, including FCOL, FC-MIS, FC-SIP, FCCSP, FCBGA, and emerging packages like CSP-LED. This advanced bonder delivers exceptional ease of operation, providing seamless production control and assistance

2100 FC hS

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BESI / ESEC

2100 FC hS

Die Bonders / Sorters / Attachers

유사 등재물

BESI / ESEC

2100 FC hS

BESI / ESEC

2100 FC hS

2100 FC hS

Die Bonders / Sorters / Attachers

유사 등재물

BESI / ESEC

2100 FC hS

BESI / ESEC

2100 FC hS