설명
Automatic placement machine Details attached환경 설정
환경 설정 없음OEM 모델 설명
Newport MRSI-605 AP Advanced Packaging Die Bonder, the ultimate solution for cutting-edge assembly needs in the semiconductor and electronic packaging markets. This advanced system offers unparalleled capabilities, catering to epoxy die attach, eutectic, and flip chip bonding, empowering manufacturers of MEMS, semiconductor packages, multi-chip modules, military and defense hybrids, microwave and RF circuits, and photonics packages.문서
문서 없음
NEWPORT
MRSI 605
검증됨
카테고리
Die Bonders
마지막 검증일: 2일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
111925
웨이퍼 사이즈:
알 수 없음
빈티지:
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
NEWPORT
MRSI 605
카테고리
Die Bonders
마지막 검증일: 2일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
111925
웨이퍼 사이즈:
알 수 없음
빈티지:
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Automatic placement machine Details attached환경 설정
환경 설정 없음OEM 모델 설명
Newport MRSI-605 AP Advanced Packaging Die Bonder, the ultimate solution for cutting-edge assembly needs in the semiconductor and electronic packaging markets. This advanced system offers unparalleled capabilities, catering to epoxy die attach, eutectic, and flip chip bonding, empowering manufacturers of MEMS, semiconductor packages, multi-chip modules, military and defense hybrids, microwave and RF circuits, and photonics packages.문서
문서 없음