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MD-P200 is a device bonder for high-speed, high-quality bonding of bare ICs for cutting-edge devices. The basic structure comprises fixed-point pickup and mounting that supports supply of wafers up to ⌀200 mm. In response to innovations in manufacturing, such as multi-functionality, miniaturization and reduced thickness, and multi-layering, various functions such as flip-chip bonding, thermosonic bonding, DAF bonding, and stacked bonding, can also be selected. Assembly of high value-added devices such as RF modules, MEMS, power devices, and sensors. Die Bonder문서
PANASONIC
MD-P200
검증됨
카테고리
Die Bonders
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
75482
웨이퍼 사이즈:
알 수 없음
빈티지:
2022
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PANASONIC
MD-P200
카테고리
Die Bonders
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
75482
웨이퍼 사이즈:
알 수 없음
빈티지:
2022
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available