메인 콘텐츠로 건너뛰기
Moov logo

Moov Icon
ASM AD898
    설명
    설명 없음
    환경 설정
    환경 설정 없음
    OEM 모델 설명
    The ASM AD898 is a state-of-the-art Die Bonder by ASM, representing a new generation of advanced technology. This fully automatic die bonding machine offers remarkable capabilities, accommodating up to 8" wafers. Its flexibility extends to handling a wide range of die sizes and leadframe/substrate configurations, allowing for quick and easy package conversion. Equipped with a fast and reliable linear bond head, high accuracy linear motor indexer platform, and high-speed Eagle Pattern Recognition System with pre/post bond inspection, the AD898 ensures precise and efficient die bonding processes. Additionally, it features a 2-in-1 epoxy writer system, further enhancing its capabilities for semiconductor manufacturing applications.
    문서

    문서 없음

    ASM

    AD898

    verified-listing-icon

    검증됨

    카테고리

    Die Sorters & Attachers
    마지막 검증일: 60일 이상 전
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    62897


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    2008

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    유사 등재물
    모두 보기
    ASM AD898
    ASMAD898Die Sorters & Attachers
    빈티지: 0조건: 중고
    마지막 검증일30일 이상 전

    ASM

    AD898

    verified-listing-icon

    검증됨

    카테고리

    Die Sorters & Attachers
    마지막 검증일: 60일 이상 전
    listing-photo-429889a39e21441481569f8152cb40ba-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    62897


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    2008


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    설명 없음
    환경 설정
    환경 설정 없음
    OEM 모델 설명
    The ASM AD898 is a state-of-the-art Die Bonder by ASM, representing a new generation of advanced technology. This fully automatic die bonding machine offers remarkable capabilities, accommodating up to 8" wafers. Its flexibility extends to handling a wide range of die sizes and leadframe/substrate configurations, allowing for quick and easy package conversion. Equipped with a fast and reliable linear bond head, high accuracy linear motor indexer platform, and high-speed Eagle Pattern Recognition System with pre/post bond inspection, the AD898 ensures precise and efficient die bonding processes. Additionally, it features a 2-in-1 epoxy writer system, further enhancing its capabilities for semiconductor manufacturing applications.
    문서

    문서 없음

    유사 등재물
    모두 보기
    ASM AD898
    ASM
    AD898
    Die Sorters & Attachers빈티지: 0조건: 중고마지막 검증일: 30일 이상 전
    ASM AD898
    ASM
    AD898
    Die Sorters & Attachers빈티지: 0조건: 중고마지막 검증일: 60일 이상 전
    ASM AD898
    ASM
    AD898
    Die Sorters & Attachers빈티지: 0조건: 중고마지막 검증일: 60일 이상 전