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ASM AD898
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    Die Bonder
    OEM 모델 설명
    The ASM AD898 is a state-of-the-art Die Bonder by ASM, representing a new generation of advanced technology. This fully automatic die bonding machine offers remarkable capabilities, accommodating up to 8" wafers. Its flexibility extends to handling a wide range of die sizes and leadframe/substrate configurations, allowing for quick and easy package conversion. Equipped with a fast and reliable linear bond head, high accuracy linear motor indexer platform, and high-speed Eagle Pattern Recognition System with pre/post bond inspection, the AD898 ensures precise and efficient die bonding processes. Additionally, it features a 2-in-1 epoxy writer system, further enhancing its capabilities for semiconductor manufacturing applications.
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    ASM

    AD898

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    Die Sorters & Attachers
    마지막 검증일: 60일 이상 전
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    제품 ID:

    93376


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    ASM AD898
    ASMAD898Die Sorters & Attachers
    빈티지: 0조건: 중고
    마지막 검증일30일 이상 전

    ASM

    AD898

    verified-listing-icon

    검증됨

    카테고리

    Die Sorters & Attachers
    마지막 검증일: 60일 이상 전
    listing-photo-47bcdd506a3e45899704dbb1b8e70991-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    93376


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    알 수 없음


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    설명 없음
    환경 설정
    Die Bonder
    OEM 모델 설명
    The ASM AD898 is a state-of-the-art Die Bonder by ASM, representing a new generation of advanced technology. This fully automatic die bonding machine offers remarkable capabilities, accommodating up to 8" wafers. Its flexibility extends to handling a wide range of die sizes and leadframe/substrate configurations, allowing for quick and easy package conversion. Equipped with a fast and reliable linear bond head, high accuracy linear motor indexer platform, and high-speed Eagle Pattern Recognition System with pre/post bond inspection, the AD898 ensures precise and efficient die bonding processes. Additionally, it features a 2-in-1 epoxy writer system, further enhancing its capabilities for semiconductor manufacturing applications.
    문서

    문서 없음

    유사 등재물
    모두 보기
    ASM AD898
    ASM
    AD898
    Die Sorters & Attachers빈티지: 0조건: 중고마지막 검증일: 30일 이상 전
    ASM AD898
    ASM
    AD898
    Die Sorters & Attachers빈티지: 0조건: 중고마지막 검증일: 60일 이상 전
    ASM AD898
    ASM
    AD898
    Die Sorters & Attachers빈티지: 0조건: 중고마지막 검증일: 60일 이상 전