설명
Includes, 6” and 8” wafer Film frame expander changeover kits, alignment tools and full set of handbook.환경 설정
환경 설정 없음OEM 모델 설명
The ASM AD898 is a state-of-the-art Die Bonder by ASM, representing a new generation of advanced technology. This fully automatic die bonding machine offers remarkable capabilities, accommodating up to 8" wafers. Its flexibility extends to handling a wide range of die sizes and leadframe/substrate configurations, allowing for quick and easy package conversion. Equipped with a fast and reliable linear bond head, high accuracy linear motor indexer platform, and high-speed Eagle Pattern Recognition System with pre/post bond inspection, the AD898 ensures precise and efficient die bonding processes. Additionally, it features a 2-in-1 epoxy writer system, further enhancing its capabilities for semiconductor manufacturing applications.문서
문서 없음
ASM
AD898
검증됨
카테고리
Die Sorters & Attachers
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
13138
웨이퍼 사이즈:
6"/150mm, 8"/200mm
빈티지:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
ASM
AD898
검증됨
카테고리
Die Sorters & Attachers
마지막 검증일: 20일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
13138
웨이퍼 사이즈:
6"/150mm, 8"/200mm
빈티지:
2006
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Includes, 6” and 8” wafer Film frame expander changeover kits, alignment tools and full set of handbook.환경 설정
환경 설정 없음OEM 모델 설명
The ASM AD898 is a state-of-the-art Die Bonder by ASM, representing a new generation of advanced technology. This fully automatic die bonding machine offers remarkable capabilities, accommodating up to 8" wafers. Its flexibility extends to handling a wide range of die sizes and leadframe/substrate configurations, allowing for quick and easy package conversion. Equipped with a fast and reliable linear bond head, high accuracy linear motor indexer platform, and high-speed Eagle Pattern Recognition System with pre/post bond inspection, the AD898 ensures precise and efficient die bonding processes. Additionally, it features a 2-in-1 epoxy writer system, further enhancing its capabilities for semiconductor manufacturing applications.문서
문서 없음