설명
Die Bonder환경 설정
2200 evo plusOEM 모델 설명
The Datacon 2200 evo plus is a versatile die bonder specifically designed for Multi Module Attach, capable of assembling various technologies on a reliable platform. This advanced machine comes with key enhancements, offering improved bonding accuracy and cost-effectiveness. With unparalleled flexibility and extensive customization options, the Datacon 2200 evo plus incorporates a new camera system and thermal compensation algorithm, ensuring higher accuracy and long-term stability. Additionally, its new image processing unit enables faster operation, contributing to increased speed.문서
문서 없음
BESI / DATACON
2200 EVO plus
검증됨
카테고리
Die Sorters & Attachers
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
102418
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
BESI / DATACON
2200 EVO plus
카테고리
Die Sorters & Attachers
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
102418
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Die Bonder환경 설정
2200 evo plusOEM 모델 설명
The Datacon 2200 evo plus is a versatile die bonder specifically designed for Multi Module Attach, capable of assembling various technologies on a reliable platform. This advanced machine comes with key enhancements, offering improved bonding accuracy and cost-effectiveness. With unparalleled flexibility and extensive customization options, the Datacon 2200 evo plus incorporates a new camera system and thermal compensation algorithm, ensuring higher accuracy and long-term stability. Additionally, its new image processing unit enables faster operation, contributing to increased speed.문서
문서 없음