설명
설명 없음환경 설정
- 10um - 15 um Accuracy - Eutectic Soldering -What is the UPH? Our production runs were > 20 UPHOEM 모델 설명
The MRSI-505 die bonder has in-line capability and is SMEMA compatible. It has high speed with overhead solid granite platform providing mechanical and thermal stability. It has ultra precision with proven worldwide ultra-precision placement accuracy. It has ease of programming with menu-driven “windows” for ease of programming and CAD downloading and uploading of management information capability. It has 360º die orientation with unique capability to locate randomly orient die over a full 360º range at high speeds. It has eutectic experience that handles a variety of eutectic attach applications such as gold silicon, gold tin and gold germanium. It has flip chip capability with integrated vision utilizing an upward-facing camera, application-specific lighting and optics and delicate handling with controlled contact force for delicate handling of GaAs devices.문서
문서 없음
NEWPORT
MRSI 505
검증됨
카테고리
Die Sorters & Attachers
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
35690
웨이퍼 사이즈:
알 수 없음
빈티지:
2003
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
NEWPORT
MRSI 505
카테고리
Die Sorters & Attachers
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
35690
웨이퍼 사이즈:
알 수 없음
빈티지:
2003
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
- 10um - 15 um Accuracy - Eutectic Soldering -What is the UPH? Our production runs were > 20 UPHOEM 모델 설명
The MRSI-505 die bonder has in-line capability and is SMEMA compatible. It has high speed with overhead solid granite platform providing mechanical and thermal stability. It has ultra precision with proven worldwide ultra-precision placement accuracy. It has ease of programming with menu-driven “windows” for ease of programming and CAD downloading and uploading of management information capability. It has 360º die orientation with unique capability to locate randomly orient die over a full 360º range at high speeds. It has eutectic experience that handles a variety of eutectic attach applications such as gold silicon, gold tin and gold germanium. It has flip chip capability with integrated vision utilizing an upward-facing camera, application-specific lighting and optics and delicate handling with controlled contact force for delicate handling of GaAs devices.문서
문서 없음