중고 NEWPORT MRSI 505 판매

설명

Tool is crated now. According to facility, tool was came offline about a year ago

환경 설정

Ultra-precise, high speed, vision guided, flexible, inline. Large work surface accommodates most input and output options. Inspection station with bottom mounted camera. Solid Granite Overhead and Base Platform Two Linear Anarad DC Motors for X-Y Axis with Glass Encoders for .5 Micron Resolution - High Precision One Brushless Ball Screw Drive Motor on Z Axis Three Dual Magnification IR Camera System with Programmable Lighting feeding into single Control Unit for Digital Display (w/Look-up Camera for Flip Chip) Power Source, Card Rack with Controller Boards, Rack Mount Industrial Computer Source Vacuum Surface Pick Up Valves, Meter & Tubing Ultra-precise, high speed, vision guided, flexible, inline. Large work surface accommodates most input and output options. Pick and place. Inspection station with bottom mounted camera, looks like flip chip. Performs epoxy die attach, eutectic bonding, flip chip and more.

OEM 모델 설명

The MRSI-505 die bonder has in-line capability and is SMEMA compatible. It has high speed with overhead solid granite platform providing mechanical and thermal stability. It has ultra precision with proven worldwide ultra-precision placement accuracy. It has ease of programming with menu-driven “windows” for ease of programming and CAD downloading and uploading of management information capability. It has 360º die orientation with unique capability to locate randomly orient die over a full 360º range at high speeds. It has eutectic experience that handles a variety of eutectic attach applications such as gold silicon, gold tin and gold germanium. It has flip chip capability with integrated vision utilizing an upward-facing camera, application-specific lighting and optics and delicate handling with controlled contact force for delicate handling of GaAs devices.