설명
설명 없음환경 설정
Metal Etcher (4 Chamber) 208V, 50/60 Hz, with Transfer Chamber Lift, HP Robot with Metal Blade, Endpoint with Four Monochromators, Smoke and Water Leak Detect, Independent Helium Cooling, Seriplex Gas Panel w/Top Feed Exhaust, Wafer Mapping, Wafer on Blade Sensors and Umbilicals. Chamber Breakdown Includes: [Chamber A: DPS R0 Poly, w/1110-01043 Source RF match AZX 90; Dual manometers with .1Torr and 10Torr Heads, Backside Helium Cooling; 200mm Cathode, & Osaka TG2003M Turbo] [Chamber B: Poly Etch: Mark II 3 Piece Chamber; Mark II Shields, MxP Magnets, ESC Cathode, Phase IV RF Match, & Alcatel 5402 CTS Turbo] [Chamber C: Poly Etch: Uni-Body Chamber; MxP Shields, MxP Magnets, ESC Cathode, Phase IV RF Match, & Alcatel 5402 CTS Turbo] [Chamber D: DPS R1 Metal/Deep Trench Etch: Source RF Match w/AZX-90 Upgrade, Dual Manometers with .1Torr and 10Torr Heads, VAT Throttling Gate Valve, Heated Pump Stack, 200mm Cathode SNNF ESC, & Alcatel ATH 1300M Turbo] [Chamber E: Wafer Orienter, 200mm Lift Hoop, 200mm Pedestal, Laser, & CCD Array] [Chamber F: Wafer Orienter , 200mm Lift Hoop, 200mm Pedestal, Laser, & CCD Array] Remote Equipment Includes: (1ea.) RF Rack with the Following Configured Generators: [(1ea.) Advanced Energy RFG/AZX Control; (2ea.) Advanced Energy RF-20RWC; (2ea.) ENI OEM 12B-02; (1ea.) ENI OEM 12B3 and (1ea.) Osaka TD2000 turbo controller]; (2ea.) Neslab HX150 with Heater Control; (1ea.) Neslab HX150 without Heater Control; (3ea.) Edwards IH80 Pumps; & (2ea.) Alcatel ADP81 Pumps.OEM 모델 설명
The Centura is Applied’s most versatile platform. Launched in 1992, over 8,000 Centura systems have been shipped to customers around the world. For ≤200mm fabrication the applications supported include CVD, epitaxy, etch, plasma nitridation and RTP. In September 1992, AMAT announced its latest generation single-wafer, multichamber platform, the Centura, to target the high temperature thin films market as well as future process applications with 0.5 micron and below specifications.문서
문서 없음
카테고리
Dry / Plasma Etch
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
57415
웨이퍼 사이즈:
알 수 없음
빈티지:
1997
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
APPLIED MATERIALS (AMAT)
CENTURA
카테고리
Dry / Plasma Etch
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
57415
웨이퍼 사이즈:
알 수 없음
빈티지:
1997
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
Metal Etcher (4 Chamber) 208V, 50/60 Hz, with Transfer Chamber Lift, HP Robot with Metal Blade, Endpoint with Four Monochromators, Smoke and Water Leak Detect, Independent Helium Cooling, Seriplex Gas Panel w/Top Feed Exhaust, Wafer Mapping, Wafer on Blade Sensors and Umbilicals. Chamber Breakdown Includes: [Chamber A: DPS R0 Poly, w/1110-01043 Source RF match AZX 90; Dual manometers with .1Torr and 10Torr Heads, Backside Helium Cooling; 200mm Cathode, & Osaka TG2003M Turbo] [Chamber B: Poly Etch: Mark II 3 Piece Chamber; Mark II Shields, MxP Magnets, ESC Cathode, Phase IV RF Match, & Alcatel 5402 CTS Turbo] [Chamber C: Poly Etch: Uni-Body Chamber; MxP Shields, MxP Magnets, ESC Cathode, Phase IV RF Match, & Alcatel 5402 CTS Turbo] [Chamber D: DPS R1 Metal/Deep Trench Etch: Source RF Match w/AZX-90 Upgrade, Dual Manometers with .1Torr and 10Torr Heads, VAT Throttling Gate Valve, Heated Pump Stack, 200mm Cathode SNNF ESC, & Alcatel ATH 1300M Turbo] [Chamber E: Wafer Orienter, 200mm Lift Hoop, 200mm Pedestal, Laser, & CCD Array] [Chamber F: Wafer Orienter , 200mm Lift Hoop, 200mm Pedestal, Laser, & CCD Array] Remote Equipment Includes: (1ea.) RF Rack with the Following Configured Generators: [(1ea.) Advanced Energy RFG/AZX Control; (2ea.) Advanced Energy RF-20RWC; (2ea.) ENI OEM 12B-02; (1ea.) ENI OEM 12B3 and (1ea.) Osaka TD2000 turbo controller]; (2ea.) Neslab HX150 with Heater Control; (1ea.) Neslab HX150 without Heater Control; (3ea.) Edwards IH80 Pumps; & (2ea.) Alcatel ADP81 Pumps.OEM 모델 설명
The Centura is Applied’s most versatile platform. Launched in 1992, over 8,000 Centura systems have been shipped to customers around the world. For ≤200mm fabrication the applications supported include CVD, epitaxy, etch, plasma nitridation and RTP. In September 1992, AMAT announced its latest generation single-wafer, multichamber platform, the Centura, to target the high temperature thin films market as well as future process applications with 0.5 micron and below specifications.문서
문서 없음