설명
설명 없음환경 설정
Wafer EtchingOEM 모델 설명
Well-established in logic, memory, and foundry fabs worldwide, eMAX provides this extensive installed base with extendibility of a proven chamber.For next generation applications, optional hardware refinements (dual-zone gas feed, multiple RF frequencies, and enhanced pumping capability) produce higher etch rates, improved uniformity, and tighter profile control while eliminating wafer-edge effects. To balance selectivity versus etch capability, especially for high aspect ratio etch, eMAX operates in a low pressure/high gas flow regime complemented by process chemistries specifically tailored to optimize resist and baselayer selectivities.Rapid wafer handling, high etch rates, and four-chamber capabilities translate into high productivity. Effective polymer deposition management through temperature controls and plasma confinement facilitates extended production runs. Longer mean time between cleans (>150 RF hours), high system throughput, 90%+ up time, and low consumables costs combine to create a production-proven, reliable, cost-effective etch system.문서
문서 없음
카테고리
Dry / Plasma Etch
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
129838
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
APPLIED MATERIALS (AMAT)
EMAX CT+ CHAMBER
카테고리
Dry / Plasma Etch
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
129838
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
Wafer EtchingOEM 모델 설명
Well-established in logic, memory, and foundry fabs worldwide, eMAX provides this extensive installed base with extendibility of a proven chamber.For next generation applications, optional hardware refinements (dual-zone gas feed, multiple RF frequencies, and enhanced pumping capability) produce higher etch rates, improved uniformity, and tighter profile control while eliminating wafer-edge effects. To balance selectivity versus etch capability, especially for high aspect ratio etch, eMAX operates in a low pressure/high gas flow regime complemented by process chemistries specifically tailored to optimize resist and baselayer selectivities.Rapid wafer handling, high etch rates, and four-chamber capabilities translate into high productivity. Effective polymer deposition management through temperature controls and plasma confinement facilitates extended production runs. Longer mean time between cleans (>150 RF hours), high system throughput, 90%+ up time, and low consumables costs combine to create a production-proven, reliable, cost-effective etch system.문서
문서 없음