설명

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환경 설정

Polysilicon Etch Etch/Ash/Clean - Plasma Processing Currently Configured for: 200mm Software: 4.8_26 MF: P5000 Mark II Qty 4 - MxP+ Poly ESC: Polymide Gases Used: N2, CF4, AR, O2, CHF3, CO, C4F8 MFCs: 28 DIgital MFC's Unit or Horiba Robot: ROBOT ASSY 8 IN AMAT 5000 Dry Pumps: 1-BA100, 2 DS80/250, 2-IQDP80/WSU151 Chillers: 2 Neslab 150

OEM 모델 설명

The AMAT P5000 Etch is a magnetically enhanced reactive ion etching system (MERIE) with two functional process chambers (Chambers B & C). P5000 Chamber B is primarily used for etching silicon based dielectrics (silicon dioxide, silcon nitride, etc.) and some carbon based compounds (resist, poly imide, etc) while chamber C is mainly used for silicon etching with high selectivity to underlying dielectric such as silicon dioxide. The system can process only 4" wafers. Pieces have to be attached to a 4" wafer. Though the process chamber processes one wafer at a time, up to 25 wafers can be loaded per batch.

문서

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APPLIED MATERIALS (AMAT)

P5000 ETCH

검증됨

카테고리

Dry / Plasma Etch

마지막 검증일: 60일 이상 전

주요 품목 세부 정보

조건:

Used

작동 상태:

알 수 없음

제품 ID:

125402

웨이퍼 사이즈:

6"/150mm, 8"/200mm

빈티지:

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Logistics Support

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

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