설명
LAM Rainbow 4528I환경 설정
LAM Rainbow 4528I - Plasma Etch Dimensions & weight estimates: Mainframe dim (cm): 111.8 x 137.2 x 167.5 Mainframe weight (kg): 788 Bypack1 dim (cm): 55.9 x 81.3 x 110.5 Bypack1 weight (kg): 135 Bypack2 dim (cm): 55.9 x 22.9 x 76.2 Bypack2 weight (kg): 120OEM 모델 설명
The Rainbow 4500 is part of the Rainbow series of etch systems introduced in 1987. It addresses processes for wafer sizes up to 200mm and feature sizes as small as 0.35 micron. The Rainbow series includes the 4400, 4500, 4600, and 4700 for etching polysilicon, oxide, aluminum, and tungsten films respectively. These systems are designed to accommodate evolving customer needs through hardware and process enhancements. The Rainbow series incorporates unique features that offer improved etch capability, reliability, and performance, including a patented wafer handling system, a proprietary source for generating stable plasma, and an overall product design that has received industry awards for quality and reliability. These features are designed to enable semiconductor manufacturers to reduce wafer particle contamination to a level that exceeds industry standards and improve etch selectivity and uniformity while maintaining profile control and process flexibility.문서
문서 없음
카테고리
Dry / Plasma Etch
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
132372
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
LAM RESEARCH CORPORATION
RAINBOW 4500
카테고리
Dry / Plasma Etch
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
132372
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
LAM Rainbow 4528I환경 설정
LAM Rainbow 4528I - Plasma Etch Dimensions & weight estimates: Mainframe dim (cm): 111.8 x 137.2 x 167.5 Mainframe weight (kg): 788 Bypack1 dim (cm): 55.9 x 81.3 x 110.5 Bypack1 weight (kg): 135 Bypack2 dim (cm): 55.9 x 22.9 x 76.2 Bypack2 weight (kg): 120OEM 모델 설명
The Rainbow 4500 is part of the Rainbow series of etch systems introduced in 1987. It addresses processes for wafer sizes up to 200mm and feature sizes as small as 0.35 micron. The Rainbow series includes the 4400, 4500, 4600, and 4700 for etching polysilicon, oxide, aluminum, and tungsten films respectively. These systems are designed to accommodate evolving customer needs through hardware and process enhancements. The Rainbow series incorporates unique features that offer improved etch capability, reliability, and performance, including a patented wafer handling system, a proprietary source for generating stable plasma, and an overall product design that has received industry awards for quality and reliability. These features are designed to enable semiconductor manufacturers to reduce wafer particle contamination to a level that exceeds industry standards and improve etch selectivity and uniformity while maintaining profile control and process flexibility.문서
문서 없음