설명
설명 없음환경 설정
Wafer EtchingOEM 모델 설명
2300 Syndion C is a product in the Syndion etch product family that provides the layer-by-layer process flexibility and control needed for cost-efficient via etch for TSV applications. It offers high process flexibility, superior profile control, and excellent uniformity to address multiple TSV etch applications. It also has a low cost of ownership due to high etch rates, excellent repeatability, and in-situ etching of multiple materials in the TSV stack. Both conventional single-step etch and rapidly alternating process (RAP) are supported. Key applications include TSV for CMOS 3D IC and TSV for image sensors.문서
문서 없음
카테고리
Dry / Plasma Etch
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
129944
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH CORPORATION
2300 SYNDION-C
카테고리
Dry / Plasma Etch
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
129944
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
Wafer EtchingOEM 모델 설명
2300 Syndion C is a product in the Syndion etch product family that provides the layer-by-layer process flexibility and control needed for cost-efficient via etch for TSV applications. It offers high process flexibility, superior profile control, and excellent uniformity to address multiple TSV etch applications. It also has a low cost of ownership due to high etch rates, excellent repeatability, and in-situ etching of multiple materials in the TSV stack. Both conventional single-step etch and rapidly alternating process (RAP) are supported. Key applications include TSV for CMOS 3D IC and TSV for image sensors.문서
문서 없음