설명
설명 없음환경 설정
Alliance A6 Platform x2 Exelan HPT Chambers x1 4520 ChamberOEM 모델 설명
Exelan HPT is Lam’s latest dielectric etch system in the 200mm Alliance® wafer processing line. It offers trend-setting performance for all dielectric applications and processes developed on it can be easily transferred to the 2300 Exelan for 200mm wafers or scaled for 300mm processing. Exelan systems feature the industry’s largest dielectric etch portfolio and meet the challenges of new materials and reduced geometries with versatile Dual Frequency Confined™ (DFC™) plasma technology, Waferless Auto Cleans™ (WAC™), and an innovative narrow gap chamber design. Exelan provides innovative solutions for every dielectric etch application, including integrating multistep processes in new materials and offering a low-risk transition to larger substrates and diminishing geometries.문서
문서 없음
카테고리
Dry / Plasma Etch
마지막 검증일: 오늘
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
148309
웨이퍼 사이즈:
8"/200mm
빈티지:
1997
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH CORPORATION
EXELAN HPT
카테고리
Dry / Plasma Etch
마지막 검증일: 오늘
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
148309
웨이퍼 사이즈:
8"/200mm
빈티지:
1997
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
Alliance A6 Platform x2 Exelan HPT Chambers x1 4520 ChamberOEM 모델 설명
Exelan HPT is Lam’s latest dielectric etch system in the 200mm Alliance® wafer processing line. It offers trend-setting performance for all dielectric applications and processes developed on it can be easily transferred to the 2300 Exelan for 200mm wafers or scaled for 300mm processing. Exelan systems feature the industry’s largest dielectric etch portfolio and meet the challenges of new materials and reduced geometries with versatile Dual Frequency Confined™ (DFC™) plasma technology, Waferless Auto Cleans™ (WAC™), and an innovative narrow gap chamber design. Exelan provides innovative solutions for every dielectric etch application, including integrating multistep processes in new materials and offering a low-risk transition to larger substrates and diminishing geometries.문서
문서 없음